Sr. Engineer, MEMS Assembly - Munich, Bavaria, Germany
Originally posted 18 September 2026 by the employer — open 0 days.
Focus on MEMS wafer-level packaging technologies.
About the role
This role involves bringing up and evolving MEMS packaging technologies for SiTime's timing products. You will work with MEMS wafer-level packaging technologies.
What you'll do
- Manage and work with MEMS back-end assembly and packaging partners.
- Evaluate the impact of assembly processes on device performance and reliability.
- Work with MEMS design and characterization teams to ensure products are designed for manufacturability (DFM).
- Coordinate and perform failure analysis to debug assembly process impact on MEMS devices.
What you'll need
- MS or PhD in Mechanical Engineering, Electrical Engineering, Physics or equivalent.
- Minimum of 5 years industrial experience.
- Experience with MEMS assembly and packaging.
- Solid understanding of MEMS design and interactions between design, fabrication, and packaging.
- Experience with reliability characterization and yield analysis.
Skills: MEMS back-end assembly, packaging partners, wafer-level packaging technologies, device performance and reliability, DFM, failure analysis
This role has been open 0 days — well below the 64-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
64 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | SiTime | All employers we track in this specialty (196 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 16 | 9374 · 108 employers |
| Median days open | 80 d | 64 d (+16 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: MEMS back-end assembly, packaging partners, wafer-level packaging technologies, device performance and reliability, DFM, failure analysis
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 29 d
- Micron Technology · 19 open roles · median 140 d
- Renesas Electronics · 19 open roles · median 22 d
- Intel Corporation · 12 open roles · median 146 d
- Monolithic Power Systems · 12 open roles · median 182 d
- onsemi · 7 open roles · median 62 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 18 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.