Sr. Director, Chiplets/FCBGA BU - Tempe, AZ, United States
Originally posted 2 October 2026 by the employer.
Lead business unit engineering programs for chiplet-based IC packages and High Density Fan-Out (HDFO) technologies.
About the role
The Senior Director, Chiplets/FCBGA BU leads a team of Business Unit engineers managing customer programs for chiplet-based IC packages, High Density Fan-Out (HDFO), and advanced packaging solutions. The role oversees product development, qualification, production ramp, and business planning activities across South Korea R&D and global high-volume manufacturing sites.
What you'll do
- Lead and develop a team of Business Unit engineers responsible for customer programs spanning early-stage R&D through high-volume manufacturing. - Serve as the primary business unit leader for strategic Tier 1 customer engagements, aligning technical and project development objectives. - Direct cross-functional teams across R&D, Production, Design, Characterization, and Simulation to execute customer roadmaps. - Oversee product lifecycle management, including package development, qualification, production ramp, and sustaining support. - Develop business forecasts, capacity plans, pricing models, cost modeling, profitability analysis, and CAPEX evaluations. - Identify and mitigate technical, operational, and supply chain risks across program execution.
What you'll need
- Bachelor's degree in Engineering, Materials Science, Mechanical Engineering, or a related technical discipline. - Minimum of 12 years of semiconductor packaging experience, including direct experience in wafer-level and IC packaging. - Demonstrated experience leading complex customer programs and cross-functional teams in a semiconductor or advanced packaging environment. - Strong understanding of IC package design principles, package architecture trade-offs, process development, and manufacturability for FCBGA technologies. - Working knowledge of semiconductor packaging materials, assembly processes, reliability requirements, failure mechanisms, and product qualification methodologies. - Experience with forecasting, capacity planning, capital expenditure planning, pricing strategies, and business case development. - Ability to travel domestically and internationally up to 10-20%.
Nice to have
- Master's degree in Engineering, Materials Science, Business Administration, or a related field. - Expertise in High Density Fan-Out (HDFO) or bridge-like chiplet module constructions, constraints, and tradeoffs. - Experience supporting Tier 1 customers in computing, networking, mobile, artificial intelligence, or high-performance computing markets. - Familiarity with Design of Experiments (DOE), Statistical Process Control (SPC), and advanced manufacturing process optimization techniques. - Experience with semiconductor package cost modeling, technology roadmaps, and strategic business planning. - Working knowledge of advanced package characterization, simulation, and reliability analysis methodologies.
Skills: chiplets, FCBGA, HDFO, pricing strategy, product lifecycle