Sr. Director, AI Technology & Manufacturing

Originally posted 1 October 2026 by the employer.

Lead the datacenter technology and manufacturing agenda within GMTO.

About the role

This role leads the datacenter technology and manufacturing agenda within GMTO to build and scale technologies, manufacturing capabilities, supply ecosystem, and an operating model for Qualcomm's expansion into datacenter. This involves integrating efforts across system-technology co-optimization (STCO), QCM, test, manufacturing, and supplier enablement, spanning silicon, packaging, substrates, memory, power, thermal management, test, and system development.

What you'll do

• Lead Qualcomm's datacenter technology and manufacturing agenda within GMTO across test, packaging, substrates, memory, power, thermal, and system development.
• Develop and own an integrated STCO roadmap across silicon, package, power, and thermal, aligned with the Datacenter BU's product plans.
• Drive execution to secure required datacenter capacity across advanced-node wafer, substrates, OSAT/CM, and memory, including CY27 supplier capacity agreements.
• Build effective relationships across the foundry, OSAT, substrate, and memory supplier ecosystem and support executive-level supplier engagements.
• Lead the stand-up and scaling of Qualcomm's datacenter test capability, including planned deployment of hardware engineers across various Qualcomm sites.
• Establish robust strategies for burn-in, system-level test, and thermal management appropriate for server-class products.

What you'll need

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, or related field and 10+ years of Hardware Engineering or related work experience.
• Deep semiconductor expertise, strong business judgment, and ability to lead across GMTO, the Datacenter BU, Qualcomm Engineering Organization, Design, Supply Chain, Finance, and external partners.
• Experience delivering complex server-class systems from concept through volume production.
• Deep understanding of semiconductor product development and manufacturing environments.
• Established relationships across foundry, OSAT, substrate, and memory suppliers, including experience with multi-year capacity negotiations.
• Technical expertise in burn-in, system-level test, thermal management, advanced packaging, and server-class manufacturing.

Nice to have

• 8 years of leadership experience in Data Center Industry, semiconductor development, test and manufacturing, including leadership at the Director level.
• Knowledge of datacenter customer requirements and rack-scale infrastructure.

Skills: datacenter technology, manufacturing strategy, supply assurance, test capability, qualification