Sr. Device Integration and Innovation Engineering (Logic and/or Memory)
$163,000 - $224,000 USD yearly
Focus on FEOL, MEOL, and BEOL integrated materials solutions for Advanced Logic, NAND, and DRAM scaling.
Originally posted 13 August 2026 by the employer.
About the role
This role serves as an integration lead focusing on enabling novel integrated materials solutions for logic and memory scaling. Work spans FEOL, MEOL, and BEOL projects for advanced logic and memory within the IMS group.
What you'll do
- Act as the integration lead for FEOL/MEOL/BEOL projects for Advanced Logic and/or Memory for the IMS group.
- Provide technical leadership for module development across logic and memory technologies, including channel, junction, gate, contact, interconnects, NAND, and DRAM.
- Design, plan, and execute process engineering projects to implement novel integrated materials solutions.
- Interact with key customers and business units to resolve complex process engineering issues addressing High Value Problems (HVP).
- Design and execute engineering experiments, analyze data, and generate internal and external documentation, specifications, and technical reports for new products.
- Conceive and implement new technology, contributing to patents, publications, and customer solution proliferations.
What you'll need
- Bachelor's Degree in engineering or a related technical discipline.
- 10 - 15 years of relevant engineering experience.
- Technical expertise in Logic and/or Memory technology, with in-depth knowledge of CMOS logic transistor formation.
- Proven track record of module development and technology contributions to logic and/or memory scaling.
- Experience leading multidisciplinary FEOL/MEOL/BEOL projects with notable complexity.
Skills: FEOL/MEOL/BEOL projects, advanced logic, memory scaling, integrated materials solutions, module development, process engineering projects
More semiconductor jobs: Applied Materials jobs · Process engineer jobs · Santa Clara jobs
First seen in our index 90 days ago, well above the 57-day median for Process Integration roles.
Process Integration · Process Integration
|
Open roles in category
256
|
Median days since first seen
57 d
|
Category median salary (all employers)
$151k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Applied Materials | All employers we track in this specialty (256 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 7 | 256 |
| Open roles in the wider Process, Fab & Equipment family | 1154 | 10173 · 117 employers |
| Median days since first seen | 72 d | 57 d (−15 d vs this employer) |
| Median salary (USD postings) | n/a | $151k |
Skills observed across this category: FEOL/MEOL/BEOL projects, advanced logic, memory scaling, integrated materials solutions, module development, process engineering projects
Who's hiring in this category
- Micron Technology · 91 open roles · median 70 d
- GlobalFoundries · 30 open roles · median 32 d
- Intel Corporation · 16 open roles · median 29 d
- onsemi · 9 open roles · median 48 d
- Renesas Electronics · 9 open roles · median 104 d
- Infineon Technologies · 8 open roles · median 21 d
How we counted: 256 open Process Integration (Process Integration) roles from 41 employers tracked in the SemiconductorJobs index, counted 11 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.