Server Finite Element Analysis (FEA) Engineer - Santa Clara, California, United States of America

Originally posted 2 July 2026 by the employer.

About the role

This role serves as a technical authority for structural simulation and system-level modeling of server platforms across package, board, server chassis assembly, and rack-level architectures. The position focuses on reference platforms based on the Snapdragon SoC for data center applications.

What you'll do

- Lead multi-scale FEA across package, board, chassis assembly, system, and rack levels. - Own system-level structural simulation, including server chassis assemblies, multi-node integration, and in-rack boundary conditions. - Lead structural dynamics modeling spanning modal, shock, drop, random vibration, harmonic response, and coupled system dynamics. - Correlate analytical models with component-, system-, and rack-level physical test data. - Define and maintain platform simulation methodologies, modeling standards, and validation frameworks. - Translate simulation results into design guidance and present technical analyses to engineering leadership, customers, and suppliers.

What you'll need

- Bachelor's degree in Engineering, Information Systems, Computer Science, or related field with 6+ years of systems engineering or related experience (or Master's with 5+ years, or PhD with 4+ years). - Strong background in structural mechanics, materials science, and structural dynamics. - 6 years of advanced FEA experience in hardware platforms spanning microelectronics packaging, BGAs/sockets, board-level systems, server chassis assemblies, and full system-level structures. - Proficiency in ANSYS, ABAQUS, HyperMesh, or equivalent tools. - Experience correlating system-level FEA with physical testing including modal, shock, vibration, and environmental tests.

Nice to have

- Ph.D. in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or related field. - 10 years of advanced FEA experience with expertise in structural and system-level FEA. - Experience with rack-scale modeling and in-rack boundary condition simulation. - Deep experience in holistic structural analysis spanning die, package, board, chassis, and rack-integrated systems. - Experience with multi-physics coupling (structural–thermal–mechanical). - Platform-level simulation ownership across multiple server generations and understanding of OCP product designs.

Skills: FEA, structural simulation, server platforms, package, board, chassis