Senior Thin Films Metals Deposition Engineer - Oregon, Hillsboro, United States

Originally posted 30 September 2026 by the employer.

This role focuses on advanced metals deposition modules across Intel 18A, Intel 3, and Intel 12nm technology nodes.

About the role

This role is responsible for enabling best-in-class process performance and manufacturability for advanced metals deposition modules.

What you'll do

• Align organizational goals with technical vision and formulate technical strategies.
• Gather diverse inputs and uplevel to the right strategic response.
• Own the resolution of technical challenges and integrate solutions across multiple groups.
• Work closely with direct and extended technology development (TD) and manufacturing (TFSM) members and Business Groups.
• Engage and interface with internal and external stakeholders, including Integration, Device, Yield, Defect Metrology, Quality and Reliability, and suppliers.
• Conceptualize strategies and put them into motion swiftly to meet challenging schedules.

What you'll need

• Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
• 6+ years of relevant experience in semiconductor manufacturing, process development, or technology development.
• 4+ years direct experience in metals deposition modules.
• Hands-on experience with thin film deposition technologies in at least one of the following areas: Frontend or middle-of-line, Backend metals / interconnect or other critical conductive or barrier/liner films supporting logic technologies.
• 3+ years of experience with one or more deposition technologies: PVD, CVD, and/or ALD for metals, conductive films, or barrier/liner stacks.
• Experience with integration and module interactions (e.g., Deposition with CMP, lithography, etch, clean) and impact of deposition on device performance and yield.

Nice to have

• Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
• Experience in advanced technology nodes (e.g., 10nm class and below), ideally with exposure to Intel 18A, Intel 3, Intel 4/7, or comparable foundry nodes.
• 5+ years of direct experience in a metals deposition module such as Contact/MOL metals (e.g., W, Co, Ru, liners/barriers), BEOL / Cu interconnect (e.g., Cu/Co/Ru/W, caps, barriers, seed), advanced liners/barriers/adhesion layers or conductive films in logic nodes.
• Experience with interconnect and MOL physics (RC performance, via/contact resistance, electromigration, reliability mechanisms) and their linkage to metals deposition and integration.
• Proven experience driving process development, optimization, and transfer to HVM.
• Experience supporting technology ramp or technology transfer from TD to HVM, including POR definition, process window characterization, and tool matching.
• Hands-on ownership of metals deposition equipment (e.g., multi-chamber PVD/CVD/ALD platforms) including qualification, matching, and release to production.
• Experience collaborating with equipment and materials suppliers on hardware changes, chamber design, or chemistry changes to improve yield, cost, or reliability.
• Cross-functional leadership experience including experience leading or contributing to cross-site and cross-functional task forces for yield excursions, defect reduction, or technology ramp and demonstrated ability to work closely with factory teams, module and technical program stakeholders to implement metals deposition solutions in HVM.

Skills: metals deposition modules, thin film deposition, PVD, CVD, ALD