Senior Staff Engineer, Thermal Simulation - San Jose, California, United States
$189,000 USD yearly
Originally posted 2 October 2026 by the employer.
About the role
This role leads thermal modeling, analysis, and solution development for semiconductors and advanced packaging technologies.
What you'll do
- Lead and perform thermal modeling and analysis for semiconductor packages, advanced packaging, and electronic systems.
- Build and analyze models using ANSYS Icepak and Siemens Flotherm, including model setup, boundary conditions, solver execution, and post-processing.
- Influence the architecture, design, materials selection, and structural integrity of high-performance advanced packaging.
- Analyze simulation and measurement results to enhance product reliability.
- Support customers throughout the product development cycle from early thermal architecture to detailed modeling and design recommendations.
- Translate customer requirements and thermal specifications into simulation methodologies.
- Develop standards and methodologies and create solutions for semiconductor and packaging applications.
- Communicate technical findings through engineering reports, presentations, and customer reviews.
- Stay current with emerging technologies in advanced packaging, HBM, 2.5D/3D integrations, high power computing, and electronics cooling.
What you'll need
- PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science with 10+ years of Industry Experience.
- Experience in the use of CFD tools such as ANSYS Icepak, Flotherm, CELSIUS for analyzing, debugging, and resolving electronic packaging issues.
- Strong understanding of heat transfer, fluid mechanics, thermal management, and electronics cooling fundamentals.
- Fundamental understanding of IC chip/package architectures and thermal design constraints.
- Working experience in SiP (System in Package) thermal analysis.
This role has been open 12 days — well below the 49-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
950
|
Median days open
49 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Samsung Semiconductor | All employers we track in this specialty (950 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 950 |
| Open roles in the wider Software, Firmware & Systems family | 13 | 6164 · 146 employers |
| Median days open | 26 d | 49 d (−23 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation · 72 open roles · median 32 d
- KLA Corporation · 64 open roles · median 42 d
- Teradyne · 52 open roles · median 26 d
- NVIDIA · 50 open roles · median 67 d
- Applied Materials · 49 open roles · median 62 d
- AMD · 45 open roles · median 47 d
How we counted: 950 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 14 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.