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STMicroelectronics

Senior/Staff Engineer, Technical Assembly (OSAT) - Singapore

STMicroelectronics Singapore 1 month ago
Packaging & Advanced Integration

Originally posted 27 August 2026 by the employer — open 22 days.

About the role

This role involves managing OSAT partners for STMicroelectronics' NPI projects, covering development, qualification, and successful deployment into mass production.

What you'll do

  • Manage OSATs on ST NPI projects for development, qualification, and mass production deployment.
  • Ensure compliance to ST NPI protocol during change management with ST stakeholders and OSATs.
  • Take accountability for results delivery for NPI to ensure product time to market.
  • Manage deployment of technical resources to support recovery of production crises, quality issues, and delivery challenges.
  • Provide technical expertise and lead OSATs to production excellence.
  • Collaborate with cross-functional teams for yield & quality improvement.
  • Assist and involve in assembly related quality issues in OSAT for root cause analysis and solutions.
  • Review and submit documentation into ST system such as TGA, NPI deliverables, frozen recipes, control plan light.

What you'll need

  • Bachelor Degree in Engineering or similar
  • Minimum 5 years of Semiconductor manufacturing experience
  • Extensive knowledge of excel and office suite

Skills: OSAT management, NPI projects, assembly, qualification, mass production

Market context

This role has been open 0 days — well below the 64-day median for Packaging Engineering roles.

Packaging Engineering · Packaging

Open roles in category
196
Median days open
64 d
Median salary
$166k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How STMicroelectronics compares in Packaging Engineering hiring
Metric STMicroelectronics All employers we track in this specialty (196 roles · 41 employers)
Open roles in this specialty 6 196
Open roles in the wider Process, Fab & Equipment family 269 9374 · 108 employers
Median days open 64 d 64 d (same as this employer)
Median salary (USD postings) — $166k

Skills observed across this category: OSAT management, NPI projects, assembly, qualification, mass production

Who's hiring in this category

  • Infineon Technologies · 28 open roles · median 29 d
  • Micron Technology · 19 open roles · median 140 d
  • Renesas Electronics · 19 open roles · median 22 d
  • Intel Corporation · 12 open roles · median 146 d
  • Monolithic Power Systems · 12 open roles · median 182 d
  • onsemi · 7 open roles · median 62 d

How we counted: 196 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 18 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.

STMicroelectronics

STMicroelectronics

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Singapore
On-site
1 month ago

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