Senior Staff Engineer / Principle Engineer (SON Package) - Batam, Indonesia
Originally posted 9 September 2026 by the employer — open 12 days.
About the role
This role involves leading packaging engineering activities for SON package products at Infineon Technologies. You will focus on process optimization within a cleanroom environment.
What you'll do
- Lead engineering activities for Molding, Mark, Trim & Form, Die Attach, Clip Attach, Final Test, Scan, and Packing processes for SON product.
- Drive process optimization to improve test yield, quality, productivity, equipment utilization, and manufacturing cost.
- Lead process and equipment qualification and process characterization.
What you'll need
- Bachelor's Degree, Master's degree or PhD in Engineering (Electrical, Electronics, Mechanical, Materials, Manufacturing, Physics, Computer or related discipline).
- Minimum 10 years of semiconductor manufacturing experience.
- Exposure to Transfer Molding processes, BESI, ASM, and Asahi equipment.
- Exposure to Marking Processes, Trim & Form operations, BESI and ASM equipment, TDSON or similar leadframe-based packages.
- Exposure to Die Attach process, Clip Attach Technology, Solder Paste and reflow processes, ASM Die Bonder platforms, and knowledge of leadframe-based power package assembly processes.
- Exposure to Final Test operations, ETS88 Test Systems, SRM (Scan and Reel Module) processes, ExisTech Handler platforms.
Nice to have
- Expertise in ASM AD series Die Bonders or equivalent platforms.
- Experience with solder paste, clip attach, and power package assembly technologies.
- Familiarity with TDSON, STOLL or similar leadframe-based packages.
- Experience with ETS88 test platform development, optimization, and troubleshooting.
- Strong knowledge of handler-test cell integration and automation systems.
Skills: Molding, Die Attach, Clip Attach, SON package, process optimization
This role has been open 12 days — well below the 67-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
67 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (196 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 27 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 321 | 9346 · 108 employers |
| Median days open | 32 d | 67 d (−35 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: Molding, Die Attach, Clip Attach, SON package, process optimization
Who's hiring in this category
- Infineon Technologies (this employer) · 27 open roles · median 32 d
- Micron Technology · 19 open roles · median 143 d
- Renesas Electronics · 19 open roles · median 25 d
- Intel Corporation · 12 open roles · median 149 d
- Monolithic Power Systems · 12 open roles · median 185 d
- onsemi · 7 open roles · median 65 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 21 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.