Senior Staff Engineer / Principal Engineer Automotive Package Concepts - Singapore
Originally posted 4 September 2026 by the employer — open 18 days.
About the role
This role involves translating automotive application and product needs into package platform requirements.
What you'll do
- Translate automotive application and product needs into package platform requirements.
- Harmonize requirements across all stakeholders.
- Trigger and follow up on feasibility studies, innovation, and pre-development projects for package solutions.
- Assess and propose project complexity in cooperation with package development teams, aligning technical, cost, and quality aspects.
- Conduct continuous market screening of competitor and subcontractor package portfolios.
- Identify business opportunities enabled by new packaging technologies and concepts with Application Engineering.
- Provide automotive package platform roadmap inputs and serve as the primary contact for package-relevant topics within ATV.
What you'll need
- Degree in electrical/electronics engineering, material science, or physics.
- 5+ years of experience in the semiconductor or automotive industry.
- Deep understanding of QFN, QFP, and/or laminate package BoM construction, materials, and related production methods/processes.
- Technical leadership with strong problem-solving and decision-making skills.
- Experience working with cross-functional international teams, especially in Asia.
- Effective communication and presentation skills.
- Fluent in English.
Skills: automotive package, package platform requirements, QFN, QFP, laminate package
This role has been open 18 days — well below the 68-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
194
|
Median days open
68 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (194 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 28 | 194 |
| Open roles in the wider Process, Fab & Equipment family | 323 | 9417 · 108 employers |
| Median days open | 33 d | 68 d (−35 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: automotive package, package platform requirements, QFN, QFP, laminate package
Who's hiring in this category
- Infineon Technologies (this employer) · 27 open roles · median 33 d
- Renesas Electronics · 20 open roles · median 25 d
- Micron Technology · 17 open roles · median 144 d
- Intel Corporation · 12 open roles · median 150 d
- Monolithic Power Systems · 12 open roles · median 186 d
- onsemi · 7 open roles · median 66 d
How we counted: 194 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.