Senior Staff Advance Packaging Designer - SG, Singapore-Design Ctr, Singapore
Originally posted 4 September 2026 by the employer.
About the role
This role involves leading end-to-end complex package design execution for high-performance computing solutions.
What you'll do
- Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met.
- Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures).
- Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams.
- Define and enhance package design methodologies, flows, and best practices.
- Mentor junior engineers and promote engineering excellence across the team.
What you'll need
- Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field.
- Experience in package design execution for complex products.
- Experience handling multiple concurrent design programs in high-pressure environments.
- Experience applying AI/ML and automation to improve design productivity and quality.
- Solid understanding of Signal Integrity and Power Integrity fundamentals.
Nice to have
- Experience in designing complex substrate design or Silicon Bridge or Interposers.
- Hands-on experience with EDA tools.
- Experience working with OSATs, foundries, and substrate vendors.
Skills: package design, substrate layouts, bump maps, interposer designs, 2.5D/3D packaging, chiplet-based architectures
This role has been open 19 days — well below the 40-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
66
|
Median days open
40 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | AMD | All employers we track in this specialty (66 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 66 |
| Median days open | 29 d | 40 d (−11 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Skills observed across this category: package design, substrate layouts, bump maps, interposer designs, 2.5D/3D packaging, chiplet-based architectures
Who's hiring in this category
- Micron Technology · 13 open roles · median 145 d
- AMD (this employer) · 6 open roles · median 29 d
- Marvell Technology · 6 open roles · median 15 d
- Broadcom · 5 open roles · median 165 d
- NVIDIA · 5 open roles · median 40 d
- Amazon · 3 open roles · median 14 d
How we counted: 66 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.