Senior Signal Integrity Engineer – Cryogenic Interconnects - CA, Santa Clara, United States
$168,000 - $264,500 USD yearly
Originally posted 29 July 2026 by the employer.
Focus on HFSS modeling and lab characterization for cryogenic interconnects and multi-layer PCBs.
About the role
NVIDIA is seeking a Senior Signal Integrity Engineer to develop cryogenic interconnect solutions for ultra-high-speed communication. You will model, simulate, and characterize multi-layer PCB and interconnect structures operating under cryogenic conditions.
What you'll do
- Develop accurate 3D EM models for PCB and interconnect structures using tools such as HFSS. - Simulate multi-layer PCB designs under cryogenic conditions. - Define high-speed constraints, SI specifications, and design guidelines across RF, materials, and thermal domains. - Collaborate closely with SI, materials, mixed-signal, and system teams to drive end-to-end interconnect performance. - Perform lab characterization and validation using network analyzers and other measurement tools. - Correlate simulation results with hardware measurements to improve modeling accuracy across PCB, package, and system domains.
What you'll need
- MS/PhD in Electrical Engineering or equivalent experience. - 5+ years of experience in signal integrity modeling and simulation using HFSS or similar EM tools. - Deep understanding of high-frequency / broadband design. - Solid understanding of multi-layer PCB design, signal behavior, and PCB materials and their electrical and physical properties. - Experience with lab measurements, including VNA and high-speed characterization. - Background in cryogenic technologies or strong interest in developing expertise in this area.
Skills: 3D EM models, PCB and interconnect structures, cryogenic conditions, ultra-high-speed communication, lab characterization
This role has been open 106 days — exactly the 106-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · Serdes Highspeed
|
Open roles in category
91
|
Median days open
106 d
|
Median salary
$200k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | NVIDIA | All employers we track in this specialty (91 roles · 34 employers) |
|---|---|---|
| Open roles in this specialty | 14 | 91 |
| Open roles in the wider Software, Firmware & Systems family | 1004 | 6296 · 145 employers |
| Median days open | 50 d | 106 d (−56 d vs this employer) |
| Median salary (USD postings) | — | $200k |
Skills observed across this category: 3D EM models, PCB and interconnect structures, cryogenic conditions, ultra-high-speed communication, lab characterization
Who's hiring in this category
- NVIDIA (this employer) · 15 open roles · median 64 d
- Qualcomm · 9 open roles · median 195 d
- AMD · 5 open roles · median 127 d
- Astera Labs · 4 open roles · median 34 d
- Graphcore · 4 open roles · median 4 d
- Keysight Technologies · 4 open roles · median 148 d
How we counted: 91 open Hardware Systems Engineering (Serdes Highspeed) roles from 34 employers tracked in the SemiconductorJobs index, counted 21 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.