$127,200 - $174,900 USD yearly
Originally posted 6 October 2026 by the employer.
About the role
This research focuses on the generation of molten tin droplets, a key ingredient for the laser produced plasma (LPP) EUV source.
What you'll do
- Guide the development of high-level architecture for droplet generation in the EUV source.
- Lead the design of droplet generation hardware and build metrology and testing capabilities.
- Provide input to technology roadmaps and define experimental designs for scientific learning objectives.
- Develop and execute system and subsystem performance tests, analyzing results to extract knowledge.
- Troubleshoot issues with droplet generation, tin delivery, and optical systems to improve performance.
- Build, improve, and maintain droplet generator models anchored by experimental validation.
- Document learning and communicate knowledge to engineering and product development teams.
What you'll need
- PhD or MS degree with 3+ years of relevant experience in Materials Engineering, Mechanical Engineering, Chemical Engineering, Material Science, Physics, or Optics.
- Hands-on experience with complex system design and build, including rapid prototyping, characterization, and troubleshooting via metrology techniques.
- Deep understanding of scientific research methods, with demonstrated knowledge in metrology development and data analysis.
- Extensive experience with experimental data analysis and development of data analysis tools with Matlab or Python and data acquisition systems like NI Labview.
- Demonstrated ability to manage and lead a research project involving multiple stakeholders and constraints.
Nice to have
- Experience with glass, ceramics, refractory materials, high pressure sealing technology in corrosive environments.
- Experience with microfluidics, liquid jet breakup, and droplet coalescence; piezoelectricity; and acoustics.
- Familiarity with modeling microfluidics, liquid jet breakup, droplet coalescence, piezoelectricity, or acoustics.
- Experience with high pressure applications such as water jet cutting, jet breakup, and nozzle design.
- Experience architecting high-level model structure into digestible components with crisp interfaces.
- Experience coordinating multiple components of a model; experience implementing physics concepts into models.
- Experience with droplet formation, sprays, common-rail diesel, and/or injectors.
- Experience with acoustics designs: resonant cavities in the kHz/MHz regime; transfer function design for enhancing/suppressing energy transfer into liquids; piezo-driven system design.
Skills: EUV, lithography, laser produced plasma, molten tin droplets, metrology
This role has been open 2 days — well below the 71-day median for Semiconductor Equipment Engineering roles.
Semiconductor Equipment Engineering · Lithography Systems
|
Open roles in category
51
|
Median days open
71 d
|
Median salary
$144k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | ASML | All employers we track in this specialty (51 roles · 12 employers) |
|---|---|---|
| Open roles in this specialty | 27 | 51 |
| Open roles in the wider Process, Fab & Equipment family | 337 | 9729 · 107 employers |
| Median days open | 35 d | 71 d (−36 d vs this employer) |
| Median salary (USD postings) | — | $144k |
Skills observed across this category: EUV, lithography, laser produced plasma, molten tin droplets, metrology
Who's hiring in this category
- ASML (this employer) · 26 open roles · median 36 d
- Micron Technology · 5 open roles · median 151 d
- Applied Materials · 4 open roles · median 98 d
- GlobalFoundries · 4 open roles · median 108 d
- Onto Innovation · 3 open roles · median 78 d
- NXP Semiconductors · 2 open roles · median 106 d
How we counted: 51 open Semiconductor Equipment Engineering (Lithography Systems) roles from 12 employers tracked in the SemiconductorJobs index, counted 9 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.