RF, Wireless & Photonics
$58,400 - $100,800 USD yearly
Originally posted 2 October 2026 by the employer.
About the role
This role supports the 300mm semiconductor process integration team, with core responsibilities including ownership of process integration from development, customer engagement to production.
What you'll do
- Develop SiPh processes in various technologies including RF, FINFET technologies, FDSOI, and eNVM.
- Collaborate with process module and packaging teams to drive process solutions.
- Work with TD and BU to oversee project scope and ensure technical needs are met.
- Drive technology cost reduction and process convergence.
- Improve yield.
What you'll need
- Bachelor's Degree with 2+ years OR Master’s Degree with 1+ years OR PhD with 1 year of working experience in a relevant field.
- Degree in Electrical Engineering, Materials Science, Solid State Physics, or other relevant engineering physical science discipline.
- Experience leading an engineering team, developing and delivering advanced technology for mass production.
- Strong project management skills, particularly focused on managing schedules, scope, and cost trade-offs.
Nice to have
- Experience in FEOL/BEOL process with FinFET and FDSOI technology.
- Strong background in FEOL/MOL/BEOL process development and characterization knowledge.
- Knowledge of Lean Manufacturing principles.
- Strong presentation and technical writing skills.
Skills: SiPh process development, process integration, FinFET technologies, FDSOI, yield improvement
USA - New York - Malta, United States
On-site
$58,400 - $100,800 USD yearly
3 days ago