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Syenta

Senior Process Engineer (Photolithography)

Syenta Arizona, United States Full-time 7 hours ago
Process & Device Engineering

Develop photolithography recipes and microfabrication workflows for Localized Electrochemical Manufacturing (LEM) stamps.

About the role

This hands-on role develops and manufactures critical components of Syenta's Localized Electrochemical Manufacturing (LEM) process, focusing on photolithography and high-resolution patterning. Work spans microfabrication and characterisation to develop stamping processes and translate prototypes into scalable manufacturing solutions.

What you'll do

  • Develop and refine process flows for the fabrication of LEM stamps.
  • Develop tool and material specific recipes for high aspect ratio structures.
  • Manufacture prototype components to support mechanical, mechatronic, and software systems.
  • Collaborate with cross-functional teams including materials scientists, chemists, and engineers, and support process transfer to commercial fabs.
  • Perform metrology and inspection to assess process quality and reproducibility.
  • Analyse experimental data and translate findings into fabrication workflow improvements.

What you'll need

  • Bachelor's degree in Nanotechnology, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science, or a related field.
  • Minimum 6 years combined experience in MEMS/microfabrication across academia or industry.
  • Experience with DWL, MLA, mask aligner, stepper, and EBL tools.
  • Hands-on experience with wet etching processes and thin film deposition.
  • Experience with photosensitive materials to produce high aspect ratio structures.
  • Experience working in semiconductor-grade cleanroom environments.

Nice to have

  • Master of Research or Ph.D. with relevant research or industry experience.
  • Experience working within commercial semiconductor fabs or local university fabs.
  • Experience with lithography materials including SU-8, AZ resist, and dry film resist.
  • Exposure to advanced packaging techniques such as wafer bonding and die bonding.
  • Exposure to nano-imprint lithography or hot embossing.
  • Knowledge of copper electroplating.

Skills: photolithography, microfabrication, stepper, cleanroom, wet etching

More semiconductor jobs: Process engineer jobs

Market context

First seen in our index 0 days ago, well below the 61-day median for Process Engineering roles.

Process Engineering · Semiconductor Process

Open roles in category
1066
Median days since first seen
61 d
Category median salary (all employers)
$137k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Syenta compares in Process Engineering hiring
Metric Syenta All employers we track in this specialty (1066 roles · 55 employers)
Open roles in this specialty 3 1066
Open roles in the wider Process, Fab & Equipment family 10 10736 · 137 employers
Median days since first seen 0 d 61 d (+61 d vs this employer)
Median salary (USD postings) n/a $137k

Skills observed across this category: photolithography, microfabrication, stepper, cleanroom, wet etching

Who's hiring in this category

  • Micron Technology · 297 open roles · median 119 d
  • Applied Materials · 62 open roles · median 77 d
  • Texas Instruments · 62 open roles · median 62 d
  • Entegris · 56 open roles · median 27 d
  • GlobalFoundries · 55 open roles · median 38 d
  • Lam Research · 55 open roles · median 26 d

How we counted: 1066 open Process Engineering (Semiconductor Process) roles from 55 employers tracked in the SemiconductorJobs index, counted 14 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.

Apply now
Arizona, United States
On-site
Full-time
7 hours ago

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