Originally posted 18 August 2026 by the employer.
This role focuses on integrating optoelectronic components for Co-Packaged Optics and Optical Engine products.
About the role
This role is responsible for the integration of optoelectronic components for advanced Co-Packaged Optics and Optical Engine products, including silicon photonics chip (PIC), electrical IC (EIC), control unit, organic substrate, and integration of lasers.
What you'll do
- Drive Co-Packaged Optics and Optical Engine product packaging activities from initial concept to production.
- Develop Silicon Photonic (PIC) and electronics IC (EIC) co-design process flow, PIC and EIC IO pad frame, and 3D interposer floor plan.
- Lead PIC and EIC interconnect schematic and monitor layout design process.
- Work with OSATs to define PIC and EIC hybrid integration packaging design rules, process flow, and material sets.
- Lead optical package development to establish package manufacturability and reliability.
- Collaborate with cross-functional teams including laser packaging, Silicon Photonics, IC design, substrate layout, and module design teams.
What you'll need
- MS/PhD in an engineering or science discipline plus 5+ years of relevant experience.
- Experience with semiconductor laser design and silicon photonics.
- Experience with New Product Introduction (NPI) and/or Product Lifecycle Management processes.
- Previous experience as an engineer in laser and silicon photonics R&D.
- In-depth understanding of all aspects of Silicon Photonics.
- Familiarity with high speed modulation in Silicon photonics including MZM, MRM, EAM at 200G and 400G.
This role has been open 59 days — slightly above the 50-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
966
|
Median days open
50 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Coherent Corp | All employers we track in this specialty (966 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 15 | 966 |
| Open roles in the wider Software, Firmware & Systems family | 33 | 6157 · 145 employers |
| Median days open | 62 d | 50 d (+12 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation · 74 open roles · median 35 d
- KLA Corporation · 65 open roles · median 43 d
- Teradyne · 57 open roles · median 29 d
- NVIDIA · 52 open roles · median 67 d
- Applied Materials · 50 open roles · median 65 d
- AMD · 47 open roles · median 49 d
How we counted: 966 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 17 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.