Senior Principal Engineer, Global Product Management - Advanced Packaging
Originally posted 15 September 2026 by the employer.
About the role
This role involves shaping technologies that enable semiconductor devices within ASM's Advanced Packaging business. The position focuses on driving innovations in advanced packaging, heterogeneous integration, chiplet architectures, and interconnect solutions.
What you'll do
- Lead advanced packaging product platforms from concept through commercialization and manufacturing.
- Define and maintain product roadmaps for emerging advanced packaging applications.
- Own product requirements, configurations, and platform options.
- Develop strategic relationships with semiconductor manufacturers, foundries, and OSATs.
- Develop and manage market and product requirement documents.
- Drive market assessments, TAM analysis, customer segmentation, competitive benchmarking, and go-to-market strategies.
What you'll need
- 5-10 years of experience in product management, technical marketing, applications engineering, process engineering, or business development within the semiconductor industry.
- Master's or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Mechanical Engineering, or a related technical field.
- Strong understanding of advanced packaging technologies, including heterogeneous integration, chiplet architectures, hybrid bonding, wafer-level packaging (WLP), panel-level packaging (PLP), 2.5D/3D integration, TSVs, redistribution layers (RDL), and advanced interconnect technologies.
- Knowledge of semiconductor manufacturing processes and equipment, particularly deposition, surface preparation, thermal processing, or related front-end and back-end technologies.
- Experience working with semiconductor manufacturers, foundries, OSATs, or advanced packaging organizations.
- Willingness and ability to travel globally (up to 25-35%).
Nice to have
- Familiarity with hybrid bonding, dielectric and metallization processes, wafer-to-wafer and die-to-wafer integration, or related advanced packaging process technologies.
- Experience with semiconductor capital equipment product management, strategic marketing, or new product introduction.
This role has been open 23 days — well below the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
312
|
Median days open
59 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | ASM International | All employers we track in this specialty (312 roles · 60 employers) |
|---|---|---|
| Open roles in this specialty | 7 | 312 |
| Open roles in the wider Process, Fab & Equipment family | 255 | 9754 · 107 employers |
| Median days open | 43 d | 59 d (−16 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 50 open roles · median 120 d
- Micron Technology · 36 open roles · median 33 d
- Renesas Electronics · 25 open roles · median 39 d
- Infineon Technologies · 16 open roles · median 58 d
- Intel Corporation · 14 open roles · median 55 d
- GlobalFoundries · 13 open roles · median 58 d
How we counted: 312 open Packaging Engineering (Advanced Packaging) roles from 60 employers tracked in the SemiconductorJobs index, counted 9 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.