Senior Optomechanical Packaging Engineer - Milpitas, CA, United States
Originally posted 5 October 2026 by the employer.
This role focuses on advanced optical and optoelectronic packaging solutions for photonics and optical communication test systems.
About the role
As an Optomechanical Packaging Engineer, you will lead the development of advanced optical and optoelectronic packaging solutions for photonics and optical communication test systems. Emphasis will be placed on active alignment processes, automated assembly equipment, motion control systems, optical packaging architectures, and long-term product reliability.
What you'll do
- Design precision optomechanical assemblies for fiber optics, photodiodes, laser sources, and photonic integrated circuits.
- Develop packaging architectures and optics that optimize optical performance, mechanical stability, thermal performance, manufacturability, reliability, and cost.
- Define optical and mechanical tolerances and alignment budgets.
- Lead development of active alignment processes for optical and optoelectronic assemblies, integrating piezo stages, nanopositioners, linear motors, servo systems, and precision encoders.
- Perform failure mode and root-cause analysis.
What you'll need
- BS, MS, or PhD in Mechanical Engineering, Optical Engineering, Physics, Mechatronics, or a related field.
- 8+ years of experience developing optomechanical or photonic products.
- Strong experience in precision optomechanical design.
- Hands-on experience with active optical alignment processes.
- Experience developing automated manufacturing or assembly systems.
- Knowledge of motion control systems and precision positioning technologies.
Nice to have
- Experience packaging photodiodes, lasers, optical receivers, optical transceivers, or photonic integrated circuits (PICs).
- Experience with optical communication products.
- Experience developing automated active alignment stations.
- Experience with machine vision systems and robotic assembly equipment.
- Familiarity with fiber-attach and photonic packaging processes.
- Experience with epoxy, solder, eutectic, or laser-welding attachment methods.
- Experience with reliability qualification standards such as Telcordia, MIL, or IEC.
- Familiarity with statistical process control and yield analysis.
- Experience working with external packaging houses and manufacturing partners.
This role has been open 1 day — well below the 60-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
311
|
Median days open
60 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | MKS Instruments | All employers we track in this specialty (311 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 311 |
| Open roles in the wider Process, Fab & Equipment family | 82 | 9631 · 109 employers |
| Median days open | 1 d | 60 d (−59 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 52 open roles · median 117 d
- Micron Technology · 36 open roles · median 38 d
- Renesas Electronics · 21 open roles · median 36 d
- Infineon Technologies · 17 open roles · median 54 d
- onsemi · 15 open roles · median 27 d
- GlobalFoundries · 13 open roles · median 69 d
How we counted: 311 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.