Senior Manufacturing Integration Engineer (OSAT & NPI) - MY, Penang, Malaysia
Originally posted 24 September 2026 by the employer.
About the role
This role involves representing AMD's manufacturing forces and collaborating with supporting teams to drive OSAT's performance and achieve business and engineering objectives. The position focuses on manufacturing issues with tier-1 suppliers and supporting cross-functional projects including new product introduction and integration.
What you'll do
- Troubleshoot equipment and test hardware issues on-site, including tester, handler, prober, ATC, probe card, and load board.
- Perform product yield analysis, identify problematic test setups/equipment, and drive DOE for recovery.
- Coordinate with AMD HWI teams to qualify new test setups and prepare for production ramp, ensuring hardware performance repeatability.
- Improve equipment maintenance efficiency by analyzing performance matrices (MTBF, utilization) and optimizing procedures.
- Monitor and report hardware design issues during HVM phase, investigate, and propose solutions or workarounds.
- Manage NPI implementation to OSAT, including product transfer, enabling, qualification stages, and engineering data collection.
What you'll need
- B.S. or M.S. in Electrical and Electronics Engineering, Mechanical, Physics, or related experience.
- Hands-on experience in program management, test hardware troubleshooting, and maintenance.
- Equipment debugging using customized diagnostics and OS's on a bench or in System Level Test platform.
- Excellent working knowledge of Advantest 93000 PS400/800/1600 tester.
- Familiarity with TEL Precio/Prexa prober, Hontech handler, Delta Summit handler, and ATC configuration.
- Knowledge of GPIB interface and protocol.
- Experience with Pareto analysis to drive a debug process.
- Familiarity with logic analyzers, voltmeters, oscilloscopes, and other debug tools.
Nice to have
- Knowledge of Advantest GS1 handler.
- Familiarity with equipment GR&R/MSA, performance correlation, and new-tool release process.
- Experience managing projects of 1-3 months duration.
This role has been open 0 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | AMD | All employers we track in this specialty (300 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 53 | 9525 · 109 employers |
| Median days open | 54 d | 58 d (−4 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 51 open roles · median 105 d
- Micron Technology · 37 open roles · median 34 d
- Infineon Technologies · 19 open roles · median 44 d
- Renesas Electronics · 19 open roles · median 24 d
- onsemi · 15 open roles · median 15 d
- Lumilens · 13 open roles · median 48 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.