Senior Manager, Semiconductor IC Packaging & Assembly Engineering - Shah Alam, my, Malaysia
Process & Device Engineering
Originally posted 24 September 2026 by the employer.
About the role
This role involves overseeing semiconductor IC packaging assembly engineering for advanced semiconductor packaging technologies, supporting assembly sustaining engineering and high-volume manufacturing execution.
What you'll do
- Support sustaining engineering for semiconductor package assembly technologies and product lines.
- Execute high-volume manufacturing improvement activities related to yield, cycle time, quality, throughput, and cost.
- Monitor assembly yield performance, trends, and corrective action progress.
- Support containment, corrective, and preventive actions for manufacturing and field quality issues.
- Support process change management for materials, equipment, tooling, flows, and sites.
- Serve as a manufacturing engineering interface for NPI-to-production transfers.
- Coordinate with global OSAT and contract manufacturing partners supporting development and production.
- Provide technical guidance and day-to-day support to assembly engineering team members.
What you'll need
- Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline.
- 15+ years of semiconductor manufacturing and packaging engineering experience with strong exposure to IC assembly operations, package development, qualification, and NPI-to-HVM transfers.
- 3+ years of experience leading technical projects, mentoring engineers, or managing small engineering teams in semiconductor manufacturing environments.
- Strong expertise in semiconductor package assembly and related processes including FET wafer metallization processing, thin die processing, wirebond, clip attach, flip chip, solder die attach, reflow, molding, package singulation, package buffing/grinding, die embedding, and SMT.
- Deep understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools.
- Experience working with global OSAT partners and outsourced manufacturing ecosystems.
- Demonstrated experience supporting successful NPI-to-HVM product ramp execution.
- Strong knowledge of semiconductor quality systems, change management, and qualification methodologies.
Nice to have
- Master’s degree or PhD in Engineering or related field.
- Experience with advanced packaging technologies for power packages, such as SiP/modules, multi-chip modules, Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages.
- Wafer-level packaging and substrate-level packaging design and technology knowledge.
- Wide-bandgap packaging knowledge for SiC and GaN dies including knowledge of DBC, AMB, and advanced interconnect technologies.
- 2.5D/3D packaging, fan-out, embedded die, and heterogeneous integration.
- Familiarity with automotive, AI/data center infrastructure power, high-performance computing, power semiconductor, and wide-bandgap product manufacturing requirements.
- Experience working with geographically distributed engineering teams and global manufacturing operations.
- Knowledge of reliability standards including JEDEC, IPC, and customer qualification requirements.
Market context
This role has been open 0 days — well below the 60-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
68
|
Median days open
60 d
|
Median salary
$175k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (68 roles · 20 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 68 |
| Open roles in the wider Process, Fab & Equipment family | 175 | 9525 · 109 employers |
| Median days open | 9 d | 60 d (−51 d vs this employer) |
| Median salary (USD postings) | — | $175k |
Who's hiring in this category
- Micron Technology · 13 open roles · median 107 d
- GlobalFoundries · 10 open roles · median 93 d
- Intel Corporation · 9 open roles · median 22 d
- Applied Materials · 8 open roles · median 30 d
- Renesas Electronics (this employer) · 6 open roles · median 39 d
- Lumilens · 4 open roles · median 48 d
How we counted: 68 open Process Integration (Advanced Packaging) roles from 20 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.