Senior Manager, HBM Customer Integration Technical Leader - Boise, ID - Main Site, United States
Originally posted 2 September 2026 by the employer.
Lead HBM customer integration as a Senior Manager.
About the role
This role involves deep technical engagement to understand customer application requirements and align them with internal HBM design, product engineering, and manufacturing processes.
What you'll do
- Develop a strong understanding of customer system architecture, application requirements, and integration challenges.
- Translate customer technical needs into actionable requirements for internal design, product engineering, and manufacturing teams.
- Provide technical mentorship on HBM architecture, signal integrity, thermal solutions, and packaging strategies.
- Develop and deploy AI systems that help automate processes and tackle technical challenges.
- Support design reviews, failure analysis, and yield improvement initiatives tied to customer requirements.
- Lead root-cause analysis for integration issues and propose design or process optimizations.
What you'll need
- Participate in technical discussions with customers, including design reviews and debug sessions.
- Communicate technical solutions clearly and effectively to both customer engineering teams and internal collaborators.
- Ensure timely resolution of technical escalations and maintain alignment across engineering and manufacturing teams.
Nice to have
- Bachelor’s or Master’s degree or equivalent experience in Electrical Engineering, Computer Engineering, or related technical field.
- 10+ years in semiconductor product engineering, system integration, or customer-facing technical roles.
- Hands-on experience with HBM architecture, packaging, and manufacturing processes.
- Ability to interpret customer system-level requirements and map them to internal design and process capabilities.
Skills: HBM architecture, customer integration, product engineering, failure analysis, yield improvement
This role has been open 44 days — below the 50-day median for Product Engineering roles.
Product Engineering · Memory Design
|
Open roles in category
97
|
Median days open
50 d
|
Median salary
$149k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (97 roles · 14 employers) |
|---|---|---|
| Open roles in this specialty | 59 | 97 |
| Open roles in the wider Silicon Validation & Test family | 202 | 2218 · 113 employers |
| Median days open | 73 d | 50 d (+23 d vs this employer) |
| Median salary (USD postings) | — | $149k |
Skills observed across this category: HBM architecture, customer integration, product engineering, failure analysis, yield improvement
Who's hiring in this category
- Micron Technology (this employer) · 59 open roles · median 73 d
- SanDisk · 14 open roles · median 57 d
- KIOXIA America · 8 open roles · median 18 d
- Cadence Design Systems · 3 open roles · median 206 d
- OmniVision · 2 open roles · median 158 d
- Solidigm · 2 open roles · median 110 d
How we counted: 97 open Product Engineering (Memory Design) roles from 14 employers tracked in the SemiconductorJobs index, counted 17 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Silicon Validation & Test family row. Figures refresh nightly.