Senior IC Packaging Designer - Atlanta, Georgia, United States
Originally posted 12 March 2026 by the employer.
About the role
Falcomm is seeking an IC Packaging Designer to support the development and implementation of semiconductor packaging solutions for RF integrated circuits. The role focuses on designing and optimizing package architectures integrating silicon, GaN, or III-V MMIC devices into production-ready packages.
What you'll do
- Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages. - Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools. - Work with signal integrity, EM, and thermal simulation teams to validate package performance. - Generate package documentation, fabrication drawings, and assembly specifications. - Collaborate with RFIC designers to co-optimize chip and package performance, minimizing parasitics and signal loss. - Support package integration with PCB design teams and coordinate with fabrication and assembly partners.
What you'll need
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline. - 3-5 years of experience designing RFIC semiconductor packages up to 50GHz (e.g., wirebond, flip-chip, PoP, or SiP). - Hands-on experience with tools such as Cadence Allegro APD/SiP or Mentor Xpedition. - Strong foundation in electrical, thermal, materials, or mechanical engineering principles relevant to IC packaging. - Ability to work full-time, onsite in Atlanta, GA.
Nice to have
- Familiarity with signal and power integrity analysis tools (such as HFSS, Q3D, PowerSI) and understanding of high-speed interface requirements such as DDR or PCIe. - Knowledge of substrate manufacturing processes, package layout constraints, and design verification tools including CAM350, Valor, or Calibre. - Experience with RFIC or 5G packaging design, along with scripting or automation skills in Python, TCL, Perl, or shell. - Ability to build accurate 3-D models of packages using Ansys Electronics Desktop, run EM simulations in HFSS, and perform thermal simulations with Icepak.
Skills: RFIC packages, Cadence Allegro, HFSS, signal integrity, assembly specifications
This role has been open 169 days — well above the 58-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
214
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Falcomm | All employers we track in this specialty (214 roles · 43 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 214 |
| Open roles in the wider Process, Fab & Equipment family | 3 | 10093 · 106 employers |
| Median days open | 169 d | 58 d (+111 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: RFIC packages, Cadence Allegro, HFSS, signal integrity, assembly specifications
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 44 d
- Renesas Electronics · 28 open roles · median 37 d
- Micron Technology · 22 open roles · median 71 d
- onsemi · 15 open roles · median 27 d
- Monolithic Power Systems · 11 open roles · median 216 d
- Intel Corporation · 9 open roles · median 107 d
How we counted: 214 open Packaging Engineering (Packaging) roles from 43 employers tracked in the SemiconductorJobs index, counted 22 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.