Senior Engineer Unit Process Engineering Soldering - Wuxi, 无锡, China
Originally posted 20 September 2026 by the employer — open 0 days.
About the role
This role involves the daily control and continuous improvement of soldering processes within backend package assembly.
What you'll do
- Control daily soldering processes, formulate process specifications, and monitor performance through statistical data.
- Analyze production abnormalities and deliver effective improvement solutions.
- Manage DDM deviation, defect handling, and MRB non-conforming lot disposition, identifying root causes using 8D, 5Why, 7 QC tools, and statistical analysis methods.
- Review, update, and maintain process documents including FMEA, chipsheet, OJTI, and GCM.
- Optimize soldering process parameters, identify weaknesses, and drive continuous yield & quality improvement.
- Implement safe launch management for new products and engineering changes, ensuring mass production stability.
What you'll need
- Bachelor's degree or above in Materials Science, Mechanical Engineering, Electronic Engineering, or related majors.
- Minimum 3 years semiconductor manufacturing experience with hands-on experience in backend package assembly (soldering, die attach, wire bonding, molding).
- Profound understanding of soldering process principles and on-site manufacturing control logic.
- Familiar with SPC, process capability analysis, yield improvement, process risk assessment.
- Proficient in FMEA, 8D, 5 Why, 7 QC Tools, DOE, MSA quality analysis tools.
- Strong data-driven analysis and on-site troubleshooting capabilities.
Skills: soldering process, backend package assembly, FMEA, SPC, yield improvement
This role has been open 0 days — well below the 54-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
54 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 20 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 317 | 9314 · 108 employers |
| Median days open | 40 d | 54 d (−14 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Skills observed across this category: soldering process, backend package assembly, FMEA, SPC, yield improvement
Who's hiring in this category
- KLA Corporation · 49 open roles · median 101 d
- Micron Technology · 36 open roles · median 28 d
- Renesas Electronics · 21 open roles · median 20 d
- Infineon Technologies (this employer) · 18 open roles · median 40 d
- Intel Corporation · 13 open roles · median 75 d
- Lumilens · 13 open roles · median 44 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 20 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.