Senior Engineer, Semi Packaging Engineering - Vendor, Taiwan
Originally posted 24 September 2026 by the employer.
About the role
This role focuses on the development of advanced packaging solutions for semiconductor devices across multiple market segments. These packaging solutions must meet demanding product performance, reliability, manufacturability, and cost requirements.
What you'll do
- Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
- Perform electrical simulations of IC packages, modules, or systems using commercial simulation tools.
- Collaborate with OSAT partners and substrate suppliers to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
- Develop and maintain package design guidelines, process specifications, and technical documentation.
What you'll need
- PhD or Master’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science.
- 2+ years of hands-on experience in semiconductor packaging development or manufacturing.
- Good understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
- Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
- Hands-on experience with electrical simulation tools such as EMPro, ADS, Sigrity, HFSS, or similar tools.
- Familiarity with RLC extraction, signal integrity, power integrity, electromagnetic simulation, and circuit simulation.
Nice to have
- Experience with Cadence Allegro.
Skills: semiconductor packaging, wire-bond, flip-chip, electrical simulations, OSAT, signal integrity
This role has been open 0 days — well below the 70-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
198
|
Median days open
70 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Analog Devices | All employers we track in this specialty (198 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 198 |
| Open roles in the wider Process, Fab & Equipment family | 196 | 9525 · 109 employers |
| Median days open | 53 d | 70 d (−17 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: semiconductor packaging, wire-bond, flip-chip, electrical simulations, OSAT, signal integrity
Who's hiring in this category
- Infineon Technologies · 29 open roles · median 35 d
- Renesas Electronics · 20 open roles · median 27 d
- Micron Technology · 18 open roles · median 146 d
- Monolithic Power Systems · 12 open roles · median 188 d
- Intel Corporation · 11 open roles · median 153 d
- onsemi · 8 open roles · median 51 d
How we counted: 198 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.