Senior Engineer II, Process Engineering (PEALD SiN)
Originally posted 16 September 2026 by the employer — open 3 days.
About the role
This role focuses on developing and optimizing advanced semiconductor deposition processes. You will contribute to innovation in ALD/PEALD, PECVD, CVD, Epitaxy, oxidation, annealing, and curing processes.
What you'll do
- Research, develop, and optimize thin film deposition processes, with a focus on metal and dielectric films using PEALD and related technologies.
- Design and execute complex experiments using Design of Experiments (DOE) and Response Surface Methodology (RSM), and interpret experimental results.
- Develop new film materials and processes for emerging semiconductor applications based on chemistry and materials science fundamentals.
- Actively troubleshoot process and equipment issues through hands-on engagement.
- Participate in and drive structured technical problem-solving using scientific methodologies and industry tools.
- Author technical papers and contribute to intellectual property (IP) generation related to process and technology development.
What you'll need
- PhD with 3+ years in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field or MS degree with 6+ years of relevant industry experience.
- Hands-on experience with PEALD, ALD, PECVD, CVD, Epitaxy, or other thin film deposition technologies.
- Strong understanding of thin film deposition principles and semiconductor process development.
- Experience designing and characterizing deposition processes using first principles and experimental design techniques.
- Ability to independently manage complex process development activities.
- Excellent communication skills in English and Korean.
Skills: R&D Process Engineer, thin film deposition processes, PEALD, ALD, PECVD, CVD, Epitaxy
This role has been open 3 days — well below the 61-day median for Process Engineering roles.
Process Engineering · Deposition Process
|
Open roles in category
53
|
Median days open
61 d
|
Median salary
$145k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | ASM International | All employers we track in this specialty (53 roles · 23 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 53 |
| Open roles in the wider Process, Fab & Equipment family | 250 | 9314 · 108 employers |
| Median days open | 71 d | 61 d (+10 d vs this employer) |
| Median salary (USD postings) | — | $145k |
Skills observed across this category: R&D Process Engineer, thin film deposition processes, PEALD, ALD, PECVD, CVD
Who's hiring in this category
- Micron Technology · 9 open roles · median 132 d
- ASM International (this employer) · 8 open roles · median 70 d
- Lam Research · 7 open roles · median 66 d
- Texas Instruments · 3 open roles · median 16 d
- Analog Devices · 2 open roles · median 6 d
- Applied Materials · 2 open roles · median 121 d
How we counted: 53 open Process Engineering (Deposition Process) roles from 23 employers tracked in the SemiconductorJobs index, counted 20 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.