Senior Engineer I, Process Engineering [CMP]

Originally posted 13 August 2026 by the employer. Relisted by the employer on 25 September 2026.

About the role

As a CMP Process Engineer, you will work with semiconductor CMP processing and analytical equipment to research, develop, optimize, and transfer polishing and post-CMP cleaning processes for advanced logic, memory, analog, power, and MEMS applications. You will design and conduct complex experiments, perform detailed data interpretation, and deliver robust processes that meet requirements for removal rate, uniformity, defectivity, planarity, and pattern-dependent performance.

What you'll do

• Develop, qualify, and optimize CMP unit processes for FEOL/BEOL applications and advanced materials to balance planarity, selectivity, and defect control.
• Formulate and tune CMP consumables and process conditions, including slurry chemistry, pads, conditioners, and post-CMP clean chemistries.
• Drive improvements in critical CMP outputs including removal rate, within-wafer non-uniformity, edge performance, dishing/erosion, and scratch/particle levels.
• Design and conduct experiments using structured tools such as Design of Experiments (DOE) and Response Surface Methodology (RSM).
• Perform rigorous analysis of complex experimental output such as RR maps, thickness/step height measurements, defect Pareto, and metrology correlation.
• Utilize metrology and characterization techniques to evaluate CMP outcomes, such as profilometry, optical/laser thickness mapping, ellipsometry, AFM, SEM, and optical inspection/defect review.

What you'll need

• Bachelor’s degree in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, Chemistry, or Physics.
• 2+ years of industry experience in CMP process development, integration, or applications engineering for semiconductor manufacturing.
• Experience with slurry chemistry and consumables: abrasives, oxidizers, complexing agents, inhibitors, surfactants, pad/conditioner selection, slurry filtration/delivery, and post-CMP cleaning.
• Experience with defectivity reduction and yield impact mitigation (scratch/particle/residue/corrosion control; cleaning and dry optimization).
• Experience with metrology and surface characterization relevant to CMP outcomes (e.g., profilometry, ellipsometry, AFM, SEM/optical inspection, particle analysis).
• Experience with structured problem solving using DOE, SPC, and root cause methods (Ishikawa, 5‑Why, FMEA).

Nice to have

• Familiarity with pattern-dependent CMP effects (density, feature scale, dummy fill, microloading), and modeling approaches for planarity and WIWNU.
• Understanding of materials interactions in CMP (galvanic corrosion, electrochemistry basics, passivation, abrasive mechanics, pad glazing/conditioning dynamics).
• Knowledge of device integration requirements across FEOL/BEOL flows and their implications for CMP (selectivity, dielectric integrity, low‑k sensitivity, barrier integrity).
• Experience supporting remote customer sites, documentation for process transfer, and cross-functional programs.
• Ability to independently manage complex CMP development projects, including schedules, experimental planning, consumables procurement, and budget awareness.
• Strong technical judgment on interplay between tool hardware, consumables, and process outcomes (mechanics + chemistry).
• Demonstrated ability to develop and fully characterize CMP processes using first principles, DOE/RSM, and robust metrology.
• Commitment to EHS and safe handling of CMP slurries and cleaning chemistries; ability to implement/adhere to chemical safety protocols.
• Tool and system prototyping and collaboration with design and software engineering

Skills: CMP process development, FEOL/BEOL applications, slurry chemistry, DOE, metrology