Senior Engineer I, AS Process Engineering - Fort Washington, PA, United States
Originally posted 31 August 2026 by the employer.
About the role
This role involves developing and optimizing advanced packaging processes in collaboration with customers and testing developed modules and system integration.
What you'll do
- Develop and optimize thermocompression, flip-chip, and other advanced packaging processes.
- Serve as the lead technical interface to customers.
- Create specifications for required technical capabilities.
- Test, troubleshoot, and recommend improvements to advanced packaging assembly equipment.
- Identify, analyze, and resolve system design weaknesses.
- Provide technical expertise for initiatives and support field teams at customer sites.
What you'll need
- Bachelor's or Master's Degree in Mechanical or Electrical Engineering, Physics, or related fields.
- Knowledge of semiconductor packaging.
- Hands-on aptitude and understanding of highly advanced machinery.
- Strong data analysis skills, including working knowledge of Matlab and/or JMP, Minitab.
- Ability to travel domestically and internationally up to 50%.
Nice to have
- Experience with flip chip, die attach or thermocompression bonding.
Skills: advanced packaging processes, thermocompression, flip-chip, die attach, packaging assembly equipment
This role has been open 24 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Kulicke & Soffa | All employers we track in this specialty (300 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 29 | 9525 · 109 employers |
| Median days open | 56 d | 58 d (−2 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: advanced packaging processes, thermocompression, flip-chip, die attach, packaging assembly equipment
Who's hiring in this category
- KLA Corporation · 51 open roles · median 105 d
- Micron Technology · 37 open roles · median 34 d
- Infineon Technologies · 19 open roles · median 44 d
- Renesas Electronics · 19 open roles · median 24 d
- onsemi · 15 open roles · median 15 d
- Lumilens · 13 open roles · median 48 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.