Senior Director Package & Assembly Engineering
$230,000 - $290,000 USD yearly
Lead packaging development, NPI, and OSAT assembly execution for critical AI/Datacenter Power programs.
Originally posted 13 November 2026 by the employer.
About the role
The Senior Director, Package & Assembly Engineering leads the organization responsible for driving execution of packaging development, new product introduction (NPI), and assembly engineering continuous improvement. This role manages program execution across internal teams and key OSAT/CM partners, including critical AI/Datacenter Power programs.
What you'll do
- Recruit, build, and lead a global team of packaging and assembly engineers supporting multiple package types and business groups.
- Partner with Package Engineering Directors to establish end-to-end NPI program plans, milestones, critical paths, risk management, and governance models through volume ramp.
- Lead cross-functional technical task forces to resolve complex issues affecting quality, reliability, yield, manufacturability, qualification, or schedule using data-driven root-cause analysis.
- Manage technical program management and assembly operations with strategic OSAT and CM partners, overseeing DOE, process optimization, and Engineering Build Requests (EBRs).
- Drive package technology roadmap execution by translating strategic priorities into executable development programs and deliverables.
- Provide concise, fact-based executive reporting on program health, critical risks, and schedule recovery plans.
What you'll need
- Bachelor’s, Master’s, or Doctorate in Electrical Engineering, Materials Science, Physics, Chemistry, or a related technical discipline.
- 15–20+ years of relevant experience in semiconductor engineering, product development, package development, NPI, manufacturing, or technical program management.
- Demonstrated experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.
- Direct experience managing development, DOE, process-window verification, and production activities with OSATs and CMs across geographically distributed organizations.
- Solid technical grasp of qualification, reliability, SPC/statistical methods, process development, and structured problem-solving methodologies.
- Willingness and ability to relocate to / be based in India for a 2-year project assignment.
Nice to have
- Experience supporting high-growth customer programs.
- Experience with formal technical program management methodologies and portfolio-level governance.
- Experience driving customer-critical NPI programs in a high-growth environment.
More semiconductor jobs: Renesas Electronics jobs · Process engineer jobs
First seen in our index 0 days ago, well below the 45-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
98
|
Median days since first seen
45 d
|
Category median salary (all employers)
$171k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (98 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 98 |
| Open roles in the wider Process, Fab & Equipment family | 196 | 10392 · 119 employers |
| Median days since first seen | 60 d | 45 d (−15 d vs this employer) |
| Median salary (USD postings) | n/a | $171k |
Who's hiring in this category
- Micron Technology · 18 open roles · median 51 d
- GlobalFoundries · 12 open roles · median 102 d
- Intel Corporation · 12 open roles · median 97 d
- SkyWater Technology · 11 open roles · median 23 d
- Applied Materials · 9 open roles · median 57 d
- Renesas Electronics (this employer) · 5 open roles · median 59 d
How we counted: 98 open Process Integration (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 13 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.