Senior Assembly Development Engineer - Fremont, CA, United States
Originally posted 26 June 2026 by the employer.
About the role
As the Senior Assembly Development Engineer, you will lead development engineering and work with contract manufacturers for high-power CW lasers and their packages. The focus includes chip-on-carrier assembly, module packaging, high speed PD, and co-packaged optics.
What you'll do
- Oversee engineering development on chip-on-carrier assembly and package/module development for high-power CW lasers, high speed PD, and co-packaged optics to optimize performance and yield. - Work closely with manufacturing teams, contract manufacturers, and Fremont product engineering and logistics teams to address operational needs and improve assembly processes. - Collaborate cross-functionally with Design, Planning, Product Engineering, and Logistics teams to ensure on-time delivery of quality products. - Utilize statistical methods to analyze reliability and test data, identifying trends and potential issues to enhance product yield and quality. - Perform thermal or thermomechanical modeling and analysis during the chip bonding process.
What you'll need
- Master’s degree or higher in Applied Physics, Materials Science, Electrical Engineering, or a related field. - Minimum 5 years of industrial experience in engineering development. - Experience with semiconductor lasers or related optoelectronic devices, such as photodiodes or devices with InP based materials. - Proficiency in data analysis and statistical evaluation related to product engineering. - Willingness to travel frequently to manufacturing sites.
Nice to have
- Direct hands-on experience in semiconductor chip packaging.
This role has been open 117 days — well above the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
303
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Coherent Corp | All employers we track in this specialty (303 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 303 |
| Open roles in the wider Process, Fab & Equipment family | 155 | 10066 · 107 employers |
| Median days open | 117 d | 63 d (+54 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 44 open roles · median 133 d
- Micron Technology · 40 open roles · median 39 d
- Renesas Electronics · 20 open roles · median 43 d
- Intel Corporation · 19 open roles · median 28 d
- GlobalFoundries · 14 open roles · median 65 d
- Lumilens · 13 open roles · median 76 d
How we counted: 303 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 22 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.