RFIC Thermal Engineer - Atlanta, Georgia, United States
Originally posted 12 March 2026 by the employer.
About the role
Falcomm is seeking an RFIC Thermal Engineer to analyze, model, and optimize thermal performance in RF integrated circuits and semiconductor packages. This role focuses on heat dissipation, thermal reliability, and thermal management strategies for high-power RF devices.
What you'll do
- Develop thermal models for RFIC devices, packages, and modules to evaluate heat dissipation and temperature distribution. - Perform thermal simulations and analysis to support design optimization and reliability improvements. - Collaborate with RFIC design and packaging teams to develop thermal management strategies. - Evaluate thermal performance across different packaging technologies and materials. - Support silicon validation and characterization related to thermal performance. - Analyze thermal failure mechanisms and recommend design or process improvements.
What you'll need
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline. - 3-5 years experience with thermal analysis, modeling, or simulation in semiconductor or electronic systems. - Strong understanding of heat transfer principles and thermal management techniques for RFICs and MMICs. - Ability to work full-time, onsite, in Atlanta, GA.
Nice to have
- Experience with thermal simulation tools such as ANSYS, COMSOL, or similar platforms. - Familiarity with semiconductor packaging technologies and thermal interface materials. - Experience analyzing high-power devices such as RF amplifiers or high-frequency ICs.
This role has been open 169 days — well above the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
303
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Falcomm | All employers we track in this specialty (303 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 303 |
| Open roles in the wider Process, Fab & Equipment family | 3 | 10093 · 106 employers |
| Median days open | 169 d | 63 d (+106 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 44 open roles · median 133 d
- Micron Technology · 40 open roles · median 39 d
- Renesas Electronics · 20 open roles · median 43 d
- Intel Corporation · 19 open roles · median 28 d
- GlobalFoundries · 14 open roles · median 65 d
- Lumilens · 13 open roles · median 76 d
How we counted: 303 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 22 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.