$115,110 - $219,550 USD yearly
Originally posted 12 October 2026 by the employer.
This role focuses on supporting dynamic stress capabilities for Intel's silicon, package, and assembly technologies.
About the role
This role involves developing, executing, and analyzing mechanical reliability and environmental stress testing programs for semiconductor devices, boards, and assemblies.
What you'll do
- Develop, plan, and execute dynamic stress tests, including shock, vibration, and other test methods in compliance with JEDEC, IPC, and/or customer requirements.
- Develop test fixtures, instrumentation strategies, and data acquisition systems to support mechanical reliability evaluations.
- Analyze test data using statistical and engineering methods to identify failure modes, performance limits, and reliability risks.
- Correlate test data to mechanical models to validate and improve simulation results.
- Generate detailed test plans, procedures, reports, and qualification documentation.
- Drive continuous improvement of laboratory capabilities, test automation, and best practices for dynamic stress testing.
- Provide technical guidance regarding shock and vibration requirements throughout the product development lifecycle.
What you'll need
- BS with 4+ years of experience, MS with 1+ years of experience, or PhD with 6 months+ of experience in shock and vibration stress testing/methods.
- Hands-on experience conducting shock and vibration testing using electrodynamic shakers and mechanical shock equipment.
- Working knowledge of JEDEC and/or IPC standards related to board-level reliability and mechanical stress testing.
- Experience developing test plans, procedures, and qualification reports.
- Proficiency with data acquisition systems, accelerometers, strain gauges, and vibration control software.
- Experience analyzing vibration and shock response data and interpreting failure mechanisms.
- Understanding of finite element analysis (FEA) results and correlation to physical testing.
Nice to have
- Deep expertise with JEDEC standards such as JESD22-B103, JESD22-B110, JESD22-B111, and other relevant mechanical reliability requirements.
- Experience interpreting and applying IPC standards including IPC-9703 and related solder joint reliability specifications.
- Familiarity with military, aerospace, or transportation standards such as MIL-STD-810, ASTM, and IEC environmental test methods.
- Advanced knowledge of vibration analysis, modal analysis, frequency response functions (FRFs), and resonance characterization.
- Proficiency with FEA tools such as Comsol Multiphysics, ANSYS, Abaqus, or Nastran.
- Experience with standard and high-speed data acquisition systems and automated test scripting using Python, MATLAB, or LabVIEW.
- Laboratory leadership experience, including test equipment specification, procurement, calibration management, and mentoring junior engineers.
- Proficiency in electrical measurements, calibration, and troubleshooting programmable DC power supplies, multimeters, and other instrumentation.
- Experience with data acquisition systems, instrumentation communication protocols (e.g., Ethernet, RS-232, GPIB), and automated test equipment.
- Knowledge of design of experiments, statistical process control, and measurement system analysis.
Skills: shock and vibration testing, JEDEC, IPC standards, failure modes, data acquisition systems
This role has been open 2 days — well below the 57-day median for Reliability Engineering roles.
Reliability Engineering · Reliability Engineering
|
Open roles in category
425
|
Median days open
57 d
|
Median salary
$158k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (425 roles · 70 employers) |
|---|---|---|
| Open roles in this specialty | 18 | 425 |
| Open roles in the wider Process, Fab & Equipment family | 193 | 9896 · 109 employers |
| Median days open | 36 d | 57 d (−21 d vs this employer) |
| Median salary (USD postings) | — | $158k |
Skills observed across this category: shock and vibration testing, JEDEC, IPC standards, failure modes, data acquisition systems
Who's hiring in this category
- Micron Technology · 75 open roles · median 146 d
- Infineon Technologies · 32 open roles · median 49 d
- Renesas Electronics · 20 open roles · median 41 d
- Intel Corporation (this employer) · 19 open roles · median 35 d
- Analog Devices · 18 open roles · median 55 d
- onsemi · 18 open roles · median 73 d
How we counted: 425 open Reliability Engineering (Reliability Engineering) roles from 70 employers tracked in the SemiconductorJobs index, counted 15 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.