Reliability Engineer – Advanced Package, Heterogenous Integration, Interposer Technologies

Originally posted 15 September 2026 by the employer.

About the role

As a Reliability Engineer, you will work hands-on with high-performance interconnect technologies that power RF, microwave, millimeter-wave, and high-speed digital products. You will play a critical part in ensuring that these technologies meet demanding performance, quality, and lifetime expectations.

What you'll do

• Design, develop, and execute reliability qualification strategies for advanced packaging, heterogeneous integration, interposer technologies, and high-performance interconnect solutions.
• Evaluate emerging packaging and integration technologies to meet stringent reliability requirements for Test & Measurement applications.
• Investigate package- and interconnect-level degradation mechanisms and develop qualification methodologies to accurately predict field performance and lifetime.
• Apply advanced statistical and data analysis techniques to identify reliability risks, understand failure mechanisms, and guide technology development decisions.
• Build and expand package reliability characterization infrastructure, enabling rapid assessment of new technologies and supporting future growth in capability and test capacity.
• Partner with technology development, product engineering, manufacturing, and supply-chain teams to translate reliability data into action that drives product success.

What you'll need

• B.S. in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field.
• Experience with advanced packaging, interposer, and heterogeneous integration technologies.
• Understanding of physical mechanisms influencing long-term package and interconnect reliability.
• Knowledge of degradation mechanisms including thermomechanical fatigue, intermetallic compound growth, electromigration, stress migration, CTE mismatch-induced failures, delamination, moisture-induced failures, wire bond and flip-chip degradation, TSV, micro-bump, hybrid bond, and interposer failure mechanisms.
• Familiarity with reliability modeling methods for package and interconnect lifetime prediction.
• Strong background in probability, statistics, and data analysis.
• Excellent analytical and problem-solving skills, including root-cause investigation and failure mechanism identification.

Nice to have

• Knowledge of high-frequency packaging and interconnect technologies used in RF, microwave, and millimeter-wave products.
• Experience with finite element analysis (FEA), thermomechanical modeling, or reliability simulation tools.
• Familiarity with materials used in advanced packaging, including underfills, molding compounds, die attach materials, substrates, and interconnect metallurgies.
• Hands-on experience applying Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.
• Experience with package failure analysis techniques including cross-sectioning, SAM, SEM, FIB, dye-and-pry, X-ray, and related methods.

Skills: Reliability qualification, advanced packaging, heterogeneous integration, failure mechanisms, stress testing, SPC, DOE