R&D Senior Architect, Package Substrate EDA - Remote
Originally posted 29 June 2026 by the employer.
Influence product strategy for 3DIC and package substrate tooling.
About the role
This role involves defining the architectural direction for package substrate design automation solutions. You will influence product strategy affecting how the industry designs advanced packages.
What you'll do
- Lead R&D projects defining architectural direction for package substrate design automation, including auto routing and DRC engines.
- Drive new technical solutions beyond incremental features, influencing product roadmap and strategic direction.
- Develop and optimize EDA software in C++, Python, and TCL to solve computational geometry and physical design automation challenges.
- Collaborate with cross-functional teams on database models, ODB++ formats, and integration with analysis tools.
- Partner with foundries and assembly and test companies to implement emerging package substrate technologies.
- Provide technical mentorship and architectural guidance to engineering teams.
What you'll need
- Deep hands-on experience in package substrate design automation, including physical design, auto routing, DRC, and power delivery network analysis.
- Strong programming skills in C++, Python, and TCL, with a track record of building production-quality EDA software.
- Proven experience leading R&D projects that resulted in new architectural solutions.
- Extensive knowledge of computational geometry algorithms and their application to physical design automation problems.
- Understanding of schematic-driven layout methodologies for package designs and related data models.
- Experience working directly with foundries and assembly and test companies to implement new package substrate technologies and translate manufacturing requirements into design automation.
Skills: package substrate EDA, 3DIC, auto routing, DRC engines, C++, computational geometry
This role has been open 44 days — well below the 73-day median for EDA/CAD Engineering roles.
EDA/CAD Engineering · EDA Tools
|
Open roles in category
675
|
Median days open
73 d
|
Median salary
$195k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Synopsys | All employers we track in this specialty (675 roles · 75 employers) |
|---|---|---|
| Open roles in this specialty | 63 | 675 |
| Open roles in the wider Physical Implementation family | 106 | 1443 · 110 employers |
| Median days open | 35 d | 73 d (−38 d vs this employer) |
| Median salary (USD postings) | — | $195k |
Skills observed across this category: package substrate EDA, 3DIC, auto routing, DRC engines, C++, computational geometry
Who's hiring in this category
- Cadence Design Systems · 153 open roles · median 169 d
- Synopsys (this employer) · 63 open roles · median 38 d
- Micron Technology · 44 open roles · median 46 d
- Qualcomm · 36 open roles · median 74 d
- GlobalFoundries · 33 open roles · median 37 d
- Keysight Technologies · 32 open roles · median 71 d
How we counted: 675 open EDA/CAD Engineering (EDA Tools) roles from 75 employers tracked in the SemiconductorJobs index, counted 17 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Physical Implementation family row. Figures refresh nightly.