R&D Engineer - Remote

Originally posted 8 September 2026 by the employer — open 12 days.

This role focuses on optical transceivers and high-speed communication modules.

About the role

This R&D Engineer role involves hands-on electrical, optical, thermal, and timing measurements of optical transceivers and high-speed communication modules, supporting NPI from architecture through production readiness. The position focuses on designing and revising printed circuit board assemblies (PCBAs) and conducting RF simulations for high-speed communication links.

What you'll do

• Perform electrical, optical, thermal, and timing measurements of optical transceivers and high-speed communication modules.
• Develop compliance and characterization reports and support NPI, including design reviews, EVT/DVT, and resolution of DFM issues.
• Design and revise printed circuit board assemblies (PCBAs).
• Conduct RF simulations and analyses of high-speed communication links.
• Analyze and resolve electrical, RF, and optical transceiver issues through hands-on testing and root-cause analysis.
• Create and maintain engineering documentation, including schematics, drawings, bills of materials (BOMs), and engineering change orders (ECOs).

What you'll need

• Bachelor’s degree in Electrical Engineering or a related field.
• At least two years of relevant experience in electrical, RF, high-speed, or optical transceiver design.
• Knowledge of circuit theory, linear systems, feedback systems, integrated circuits, and high-speed RF fundamentals.
• Understanding of data-center and AI architectures, including scale-up, scale-out, and scale-across networking, and how optical transceivers support high-speed interconnects.
• Familiarity with Ethernet, InfiniBand, PCIe, or comparable high-speed interconnect technologies.
• Experience with electronic design, product development cycles, ECAD, and system modeling tools.

Nice to have

• Advanced degree (Master’s or Ph.D.) in Electrical Engineering, Electronics, Photonics, or RF Engineering.
• RF design and electromagnetic modeling experience using tools such as CST or HFSS.
• Knowledge of embedded and AI computing architectures, including microprocessors, GPUs, TPUs, HBM, NICs, DPUs, switching fabrics, and real-time control firmware.
• Background in designing or testing optical transceivers, optoelectronic modules, or high-speed communication systems.
• Practical exposure to manufacturing, DFM, supplier engagement, or new product introduction.

Skills: optical transceivers, high-speed communication, RF simulations, electrical measurements, PCBA design