Quantum Superconducting Materials Engineer - USA - New York - Malta, United States
$143,000 - $247,000 USD yearly
Originally posted 19 May 2026 by the employer.
This role focuses on quantum advanced packaging, specifically cryogenic and superconducting materials for high-performance, scalable quantum packaging technologies.
About the role
This role involves the development, selection, and integration of cryogenic and superconducting materials for high-performance, scalable quantum packaging technologies. You will contribute to the quantum advanced packaging team at GlobalFoundries Fab8, focusing on materials that enable quantum systems from concept through manufacturing.
What you'll do
- Lead the selection and development of materials systems for cryogenic and superconducting packaging, including superconducting metals, interconnect materials, dielectric, substrate, and bonding interface materials.
- Drive the integration of materials into 2D, 2.5D, and 3D advanced packaging architectures, defining material stacks and interfaces across BEOL / RDL layers, interposers, TSVs, bump, and bonding interfaces.
- Own materials-related process integration from early development through prototyping and qualification, including process development, optimization, and control plans for deposition, plating, bonding, and surface preparation.
- Develop a deep understanding of temperature-dependent material properties, including superconducting transitions, electrical resistivity, RF loss, thermal transport behavior, and mechanical stress/CTE mismatch.
- Define and utilize characterization methods (electrical, thermal, structural) to evaluate materials performance and correlate material behavior with device- and system-level performance impacts.
- Develop material solutions and process mitigations to enhance reliability, identifying and analyzing failure mechanisms such as delamination, interface failure, diffusion / intermetallic formation, and stress-induced cracking during thermal cycling.
What you'll need
- Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or related field.
- 15 years of prior related work experience with an MS degree.
- Overall GPA of 3.0 or higher.
- Fluency in English (written & verbal).
Nice to have
- PhD education level with at least 12 years of prior related work experience.
- Prior leadership experience.
- Project management skills.
Skills: superconducting materials, cryogenic packaging, advanced packaging architectures, BEOL / RDL layers, process integration, thermal transport behavior, reliability
This role has been open 100 days — well above the 57-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
310
|
Median days open
57 d
|
Median salary
$164k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | GlobalFoundries | All employers we track in this specialty (310 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 310 |
| Open roles in the wider Process, Fab & Equipment family | 301 | 9590 · 109 employers |
| Median days open | 82 d | 57 d (+25 d vs this employer) |
| Median salary (USD postings) | — | $164k |
Skills observed across this category: superconducting materials, cryogenic packaging, advanced packaging architectures, BEOL / RDL layers, process integration, thermal transport behavior
Who's hiring in this category
- KLA Corporation · 52 open roles · median 111 d
- Micron Technology · 37 open roles · median 35 d
- Renesas Electronics · 19 open roles · median 31 d
- Infineon Technologies · 17 open roles · median 49 d
- onsemi · 15 open roles · median 22 d
- Intel Corporation · 13 open roles · median 49 d
How we counted: 310 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 1 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.