Quantum Packaging Thermal Architect - Oregon, Hillsboro, United States
$141,910 - $200,340 USD yearly
Originally posted 23 September 2026 by the employer.
This role focuses on silicon-based quantum processors leveraging spin qubit technology in silicon quantum dots.
About the role
This role is responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You will contribute to the development of scalable quantum systems that will revolutionize computing, specifically for silicon-based quantum processors utilizing spin qubit technology.
What you'll do
- Perform thermal modeling and simulation of packaging hardware to understand heat flow from silicon test chips through various heat spreader hardware.
- Manage the overall integration of packaging hardware and enable co-design between relevant stakeholders.
- Work closely with mechanical designers to define heat spreaders for optimal performance.
- Deliver and disseminate design milestones to stakeholders.
- Communicate designs in presentations and relevant documentation.
- Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers.
What you'll need
- M.S. degree in Electrical Engineering, Physics, or a related field AND 5+ years of experience in Thermal modeling and simulation for packaging or other related hardware; OR Ph.D. degree in Electrical Engineering, Physics, or a related field with academic or work experience in these areas.
- Experience with thermal/mechanical modeling, simulation, and optimization with simulation software such as Ansys Icepak, COMSOL, and related.
- Understanding of packaging technologies and thermal integration.
Nice to have
- 2+ years of experience with thermal/mechanical cryogenic packaging modeling and simulation.
This role has been open 23 days — well below the 50-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
966
|
Median days open
50 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (966 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 73 | 966 |
| Open roles in the wider Software, Firmware & Systems family | 205 | 6119 · 145 employers |
| Median days open | 35 d | 50 d (−15 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation (this employer) · 74 open roles · median 35 d
- KLA Corporation · 65 open roles · median 43 d
- Teradyne · 57 open roles · median 29 d
- NVIDIA · 52 open roles · median 67 d
- Applied Materials · 50 open roles · median 65 d
- AMD · 47 open roles · median 49 d
How we counted: 966 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 17 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.