Quantum 3DHI Engineer (2027 New College Graduate)
Originally posted 11 September 2026 by the employer — open 8 days.
About the role
GlobalFoundries is seeking a motivated R&D bonding integration engineer to become part of our Quantum Advanced Packaging team. This role entails 3D heterogeneous integration (3DHI) development including wafer-to-wafer and die-to-wafer bonding.
What you'll do
- Drive 3DHI process development efforts and planning.
- Collaborate with OSATs to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes.
- Develop expertise in processes, materials, and tooling leveraging available characterization resources.
- Drive a mechanistic understanding of failure modes.
- Develop integration schemes to continuously improve yields and to reduce cycle time & costs.
- Generate IP related to novel wafer integration & packaging technology.
What you'll need
- Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field.
- Prior related internship or co-op experience.
- Overall 3.0 GPA and proven good academic standing.
- English fluency (Written & Verbal).
- Ability to travel up to 10%.
Nice to have
- PhD education level.
- Fundamental knowledge of semiconductor packaging process modules and integration.
- Demonstrated prior leadership experience.
- Project management skills.
- Strong written and verbal communication skills.
- Strong planning and organizational skills.
This role has been open 8 days — well below the 54-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
54 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | GlobalFoundries | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 284 | 9314 · 108 employers |
| Median days open | 71 d | 54 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 101 d
- Micron Technology · 36 open roles · median 28 d
- Renesas Electronics · 21 open roles · median 20 d
- Infineon Technologies · 18 open roles · median 40 d
- Intel Corporation · 13 open roles · median 75 d
- Lumilens · 13 open roles · median 44 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 20 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.