Quality and Reliability Engineer (Advance Packaging & Assembly) - Penang, Malaysia
Originally posted 23 September 2026 by the employer.
This role supports Intel's advanced packaging programs (EMIB, Foveros).
About the role
This role is for a Manufacturing Quality and Reliability Engineer focused on advanced packaging programs, ensuring products and processes meet rigorous quality and reliability standards from wafer fabrication through packaging and assembly.
What you'll do
- Apply Advanced Packaging expertise to assess inline process health, excursion impact, yield risk, defect mechanisms, and downstream packaging implications.
- Drive effective root cause analysis, systemic corrective and prevention actions using 8D and related problem-solving methodologies.
- Strengthen early excursion detection, process controls, in-line screens, and outgoing quality in collaboration with cross-functional teams.
- Drive quality control improvements using statistical process control, defect pareto analysis, control plans, audit learnings, and excursion prevention indicators.
- Support manufacturing excursion management, including MRB facilitation, containment strategies, rapid product risk assessment, and discrepant material disposition decisions.
- Use data extraction and statistical analysis tools, and custom scripting to flag product, process, or customer risks.
What you'll need
- Bachelor or Master's degree in Materials Science, Physics, Chemical Engineering, Mechanical Engineering, or a related field with relevant experience in semiconductor manufacturing (wafer-level assembly WLA, Die prep, packaging Substrates).
- At least 3 years of relevant work experience in semiconductor manufacturing (wafer-level assembly WLA, Die prep, packaging Substrates) with a bachelor's degree.
- Experience in quality and reliability methodologies, excursion management, and failure mode analysis.
- Proficiency in statistics and data analytics tools for quality and reliability assessments.
- Familiarity with QnR Quality Systems and tools.
- Effective verbal and written communication.
Nice to have
- Influencing skills to drive a quality-focused mindset across the organization.
- Proven ability to manage impactful quality events.
Skills: quality and reliability, advanced packaging, excursion management, root cause analysis, statistical process control
This role has been open 0 days — well below the 54-day median for Reliability Engineering roles.
Reliability Engineering · Reliability Engineering
|
Open roles in category
432
|
Median days open
54 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (432 roles · 72 employers) |
|---|---|---|
| Open roles in this specialty | 17 | 432 |
| Open roles in the wider Process, Fab & Equipment family | 175 | 9479 · 109 employers |
| Median days open | 21 d | 54 d (−33 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Skills observed across this category: quality and reliability, advanced packaging, excursion management, root cause analysis, statistical process control
Who's hiring in this category
- Micron Technology · 76 open roles · median 137 d
- Infineon Technologies · 35 open roles · median 35 d
- Analog Devices · 22 open roles · median 42 d
- onsemi · 22 open roles · median 67 d
- Applied Materials · 20 open roles · median 53 d
- Renesas Electronics · 18 open roles · median 61 d
How we counted: 432 open Reliability Engineering (Reliability Engineering) roles from 72 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.