Originally posted 9 September 2026 by the employer.
This role is within the Application Specific Microcontrollers (ASM) Business Unit.
About the role
This role is responsible for leading a cross-functional team in the execution of releasing new products and ensuring successful return on investment for developments within the Application Specific Microcontrollers (ASM) Business Unit, which focuses on automotive and industrial markets with MCUs for ADAS, body electronics, powertrain control, industrial automation, and motor control applications.
What you'll do
- Lead a cross functional team on the execution of releasing new products and ensuring successful return on investment.
- Work with wafer fabrication, assembly & test sites to guarantee schedule, cost and quality.
- Plan the project using MS Project from Assess Opportunity Phase to Release to Market and manage project budget.
- Provide clear direction to team and external support organizations like device fabrication and assembly and test sites.
- Drive and motivate team members critical to the flawless execution of each product and project.
- Perform product reliability and characterization of integrated circuits to ensure they meet product requirement specifications and manufacturing requirements.
- Maintain thorough and up-to-date project schedules with all related milestones.
- Develop and implement Qualification plans.
What you'll need
- Bachelor's degree in Electrical Engineering, ECE, Computer Engineering, Mechanical Engineering or related engineering degree.
- 2+ years of engineering experience with project engineering/management experience on highly complex products/projects.
- Proven leadership capabilities in leading multifaceted global organizations.
- Successful proven track record in indirect management and influence.
Nice to have
- Ability to manage multiple projects simultaneously, and set realistic plans based on required tasks with available resources.
- Ability to effectively coordinate and lead global development teams on projects that include design, silicon fabrications, production test development, qualification and production ramp.
- Knowledge of device packaging and wafer fabrication process.
- Knowledge of reliability requirements and tri-temp characterization methodology using statistical analysis.
- Ability to work with global customers to align project schedules with customers' key milestones.
Skills: Program Management Engineer, cross functional team, new products, project schedules, product reliability
This role has been open 35 days — below the 43-day median for Technical Program Management roles.
Technical Program Management · Automotive IC
|
Open roles in category
39
|
Median days open
43 d
|
Median salary
—
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Texas Instruments | All employers we track in this specialty (39 roles · 9 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 39 |
| Median days open | 22 d | 43 d (−21 d vs this employer) |
| Median salary (USD postings) | — | — |
Skills observed across this category: Program Management Engineer, cross functional team, new products, project schedules, product reliability
Who's hiring in this category
- Mobileye · 10 open roles · median 53 d
- NXP Semiconductors · 6 open roles · median 29 d
- Qualcomm · 5 open roles · median 43 d
- Renesas Electronics · 5 open roles · median 56 d
- NVIDIA · 4 open roles · median 14 d
- Infineon Technologies · 3 open roles · median 97 d
How we counted: 39 open Technical Program Management (Automotive IC) roles from 9 employers tracked in the SemiconductorJobs index, counted 15 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.