Product Pathfinding Engineer- HIG-TPG
Develop JEDEC-HBM and Near Memory DRAM solutions across 2.5D and 3D integration architectures.
Originally posted 2 November 2026 by the employer.
About the role
This role leads the development of JEDEC-HBM or alternative Near Memory DRAM solutions, including the implementation of 2.5D and 3D packaging and electrical solutions. You will act as a primary product engineering interface across Research and Development, Manufacturing, Marketing, and Quality Assurance.
What you'll do
- Collaborate with customers, Technology Development (TD), Test, and Manufacturing to capture requirements and findings for product development.
- Partner with System Engineering, Component Validation, and Media Health teams to plan for technology node changes and secure test coverage for upcoming Alpha products.
- Resolve silicon findings according to target timelines for issue closure on assigned designs.
- Interface with Build, Verification, Product Architecture, System Compatibility Group, and Silicon Strategy teams to ensure product delivery.
- Identify and coordinate build readiness improvement initiatives to incorporate learned lessons into engineering workflows.
- Coordinate with the Product Leadership Team to integrate build readiness into overarching product leadership strategy and execution timelines.
What you'll need
- Degree in Electrical Engineering, Computer Engineering, or a related field with industry experience in high-speed datapath design, logic development, and advanced circuit analysis.
- Experience solving complex technical problems through hands-on analytical and debugging techniques.
- Demonstrated experience collaborating across multi-functional engineering teams to achieve project objectives.
- Interpersonal and presentation skills to interface with and influence technical partners.
Nice to have
- Technical leadership experience guiding projects and engineering decisions across teams.
- Familiarity with DRAM architecture, design, and related semiconductor technologies.
- Understanding of how product yield, quality, and manufacturing efficiency impact business performance.
- Experience collaborating across multi-functional teams in multiple geographic locations.
Skills: DRAM, product pathfinding, silicon validation, high-speed datapath, test coverage
More semiconductor jobs: Micron Technology jobs · Product engineer jobs
This role has been open 3 days — well below the 65-day median for Product Engineering roles.
Product Engineering · Memory Design
|
Open roles in category
83
|
Median days open
65 d
|
Category median salary (all employers)
$192k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (83 roles · 10 employers) |
|---|---|---|
| Open roles in this specialty | 54 | 83 |
| Open roles in the wider Silicon Validation & Test family | 176 | 2382 · 120 employers |
| Median days open | 82 d | 65 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $192k |
Skills observed across this category: DRAM, product pathfinding, silicon validation, high-speed datapath, test coverage
Who's hiring in this category
- Micron Technology (this employer) · 54 open roles · median 83 d
- SanDisk · 14 open roles · median 7 d
- KIOXIA America · 4 open roles · median 35 d
- Cadence Design Systems · 3 open roles · median 226 d
- OmniVision · 2 open roles · median 178 d
- Solidigm · 2 open roles · median 15 d
How we counted: 83 open Product Engineering (Memory Design) roles from 10 employers tracked in the SemiconductorJobs index, counted 6 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Silicon Validation & Test family row. Figures refresh nightly.