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AMD

Product Development Engineer – Thermal Engineering - TX, Austin, United States

AMD US, TX, Austin, United States Full-time 3 months ago
Digital Design & SoC Architecture

$114,100 - $195,600 USD yearly

Originally posted 15 July 2026 by the employer.

About the role

AMD is seeking a Thermal Engineer within the advanced packaging and New Product Introduction (NPI) organization. The role focuses on thermal characterization, validation, and technology development for package architectures and products.

What you'll do

- Lead thermal characterization activities, including Thermal Test Vehicle (TTV) development, testing, data analysis, and validation. - Develop thermal models and correlate simulation results with laboratory measurements. - Partner with package design, reliability, manufacturing, test, and product engineering teams to evaluate thermal performance and address risks. - Support qualification, product bring-up, manufacturing transfers, and production activities with OSAT partners. - Investigate thermal issues, perform root-cause analysis, and implement corrective actions. - Contribute to technology pathfinding and continuous improvement of thermal methodologies and laboratory infrastructure.

What you'll need

- Understanding of heat transfer principles and thermal management techniques. - Experience with Thermal Test Vehicles (TTVs), thermal characterization, and laboratory testing. - Experience with thermal modeling, simulation correlation, and data analysis. - Experience supporting NPI, qualification, manufacturing, or OSAT engagements. - Bachelor's degree in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Materials Science & Engineering, or a related engineering discipline.

Nice to have

- Advanced degree in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Materials Science & Engineering, or a relevant engineering field. - Experience in thermal engineering within semiconductor, electronics, data center, or advanced packaging environments.

Market context

This role has been open 97 days — well above the 52-day median for Hardware Systems Engineering roles.

Hardware Systems Engineering · AI ML Hardware

Open roles in category
973
Median days open
52 d
Median salary
$155k
See the full market breakdown ▾Category comparison, and who else is hiring
How AMD compares in Hardware Systems Engineering hiring
Metric AMD All employers we track in this specialty (973 roles · 101 employers)
Open roles in this specialty 47 973
Open roles in the wider Software, Firmware & Systems family 410 6222 · 145 employers
Median days open 52 d 52 d (same as this employer)
Median salary (USD postings) — $155k

Who's hiring in this category

  • Intel Corporation · 76 open roles · median 36 d
  • KLA Corporation · 65 open roles · median 46 d
  • Teradyne · 56 open roles · median 32 d
  • NVIDIA · 52 open roles · median 67 d
  • Applied Materials · 50 open roles · median 68 d
  • AMD (this employer) · 46 open roles · median 50 d

How we counted: 973 open Hardware Systems Engineering (AI ML Hardware) roles from 101 employers tracked in the SemiconductorJobs index, counted 20 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.

Apply now
US, TX, Austin, United States
On-site
Full-time
$114,100 - $195,600 USD yearly
3 months ago

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