Process Technician - Chon Buri, Thailand
Originally posted 10 September 2026 by the employer — open 12 days.
About the role
This role involves supporting semiconductor and photonics assembly processes in both NPI and production environments.
What you'll do
- Support die attach and wire bonding operations, including machine setup, recipe loading, tooling change, and process monitoring.
- Perform epoxy dispensing, die placement, curing, wire bonding, and visual inspection according to approved procedures.
- Support NPI builds, process trials, DOE, qualification runs, and production ramp activities under engineering guidance.
- Perform equipment troubleshooting, preventive maintenance, and process parameter verification.
- Conduct or support die shear, wire pull, ball shear, and other process quality checks.
- Record process data, defects, equipment issues, and test results accurately.
- Support engineers in yield improvement, root-cause analysis, material evaluation, and process optimization.
What you'll need
- Experience with semiconductor packaging, optical modules, silicon photonics, or optical transceiver manufacturing.
- Experience with Au wire bonding.
- Experience with conductive or non-conductive die attach epoxy.
- Experience with eutectic die bonding.
- Familiarity with die shear, wire pull, ball shear, and visual inspection criteria.
- Basic understanding of SPC, process capability, DOE, and manufacturing process control.
- Experience supporting NPI, engineering builds, qualification lots, or production ramp.
Skills: Die Attach, Wire Bond, semiconductor and photonics assembly, epoxy dispensing, process qualification
This role has been open 12 days — well below the 57-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
296
|
Median days open
57 d
|
Median salary
$172k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Lumilens | All employers we track in this specialty (296 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 13 | 296 |
| Open roles in the wider Process, Fab & Equipment family | 48 | 9417 · 108 employers |
| Median days open | 46 d | 57 d (−11 d vs this employer) |
| Median salary (USD postings) | — | $172k |
Skills observed across this category: Die Attach, Wire Bond, semiconductor and photonics assembly, epoxy dispensing, process qualification
Who's hiring in this category
- KLA Corporation · 49 open roles · median 103 d
- Micron Technology · 37 open roles · median 32 d
- Infineon Technologies · 19 open roles · median 42 d
- Renesas Electronics · 19 open roles · median 22 d
- Lumilens (this employer) · 13 open roles · median 46 d
- onsemi · 13 open roles · median 25 d
How we counted: 296 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.