Process Engineer (Packing/AVI) - Bayan Lepas, my, Malaysia
Originally posted 20 September 2026 by the employer — open 1 day.
Responsible for leadership on Packing and Auto VI Process.
About the role
This role involves providing engineering leadership and technical support to meet company objectives in Quality, Cost, and Delivery. You will take leadership on Packing and Auto VI Process, collaborating with other departments for new equipment start-up.
What you'll do
- Lead and drive yield, process, and cost improvement activities.
- Provide technical support for quality issues by leading or supporting root cause investigations and implementing corrective actions.
- Set up new equipment or new products for Packaging and AVI process.
- Support and participate in Automation projects utilizing AI, RPA, Power Automate, and Software integration.
- Develop, maintain, and update technical specifications, documentation (PFMEA, Control Plans), and equipment recipes.
What you'll need
- Degree in Engineering or equivalent.
- Working experience in semiconductor manufacturing or process engineering (Packaging or Auto VI).
- Strong troubleshooting and problem-solving skills.
- Ability to work with minimal supervision.
- Good project management skills.
- Demonstrated ability to drive continuous improvement.
Nice to have
- Knowledge in Auto Vision such as Vitrox equipment.
- Familiarity with Smart Cameras with AI Learning.
- Knowledge in Semiconductor Packaging material.
- Knowledge in AI, RPA, Power Automate.
Skills: Packaging, Auto VI Process, yield improvement, process improvement, equipment set-up
This role has been open 1 day — well below the 68-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
194
|
Median days open
68 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (194 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 20 | 194 |
| Open roles in the wider Process, Fab & Equipment family | 171 | 9417 · 108 employers |
| Median days open | 26 d | 68 d (−42 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: Packaging, Auto VI Process, yield improvement, process improvement, equipment set-up
Who's hiring in this category
- Infineon Technologies · 27 open roles · median 33 d
- Renesas Electronics (this employer) · 20 open roles · median 25 d
- Micron Technology · 17 open roles · median 144 d
- Intel Corporation · 12 open roles · median 150 d
- Monolithic Power Systems · 12 open roles · median 186 d
- onsemi · 7 open roles · median 66 d
How we counted: 194 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.