Process Engineer - Krubong, MY, Malaysia
About the role
This role involves optimizing and troubleshooting semiconductor manufacturing processes related to Pre-Assembly, Die Bond, and Wire Bond, focusing on yield improvement and defect reduction.
What you'll do
- Manage Pre-Assembly, Die Bond & Wire Bond processes.
- Perform process troubleshooting and optimization.
- Implement yield improvement and defect reduction strategies.
- Conduct Root Cause Analysis (RCA).
- Establish Design of Experiment (DOE) for process improvement projects.
- Evaluate raw materials for cost saving, quality, and lead-time reduction.
What you'll need
- Bachelor’s Degree in Mechanical / Manufacturing / Electrical / Electronic engineering.
- Minimum 5 years of relevant working experience in IC/semiconductor environment.
- Experience in Wire Bond, Die Attach and Pre-Assembly.
- SPC, QCC 7 tools, DOE and problem-solving skills.
- Material, Process and Specification writing Knowledge.
Skills: Pre-Assembly process, Die Bond & Wire Bond, Process troubleshooting, Yield improvement, Root Cause Analysis
This role has been open 0 days — well below the 84-day median for Process Engineering roles.
Process Engineering · Semiconductor Process
|
Open roles in category
1057
|
Median days open
84 d
|
Median salary
$147k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Vishay Intertechnology | All employers we track in this specialty (1057 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 23 | 1057 |
| Open roles in the wider Process, Fab & Equipment family | 161 | 9593 · 108 employers |
| Median days open | 47 d | 84 d (−37 d vs this employer) |
| Median salary (USD postings) | — | $147k |
Skills observed across this category: Pre-Assembly process, Die Bond & Wire Bond, Process troubleshooting, Yield improvement, Root Cause Analysis
Who's hiring in this category
- Micron Technology · 350 open roles · median 146 d
- Applied Materials · 84 open roles · median 147 d
- GlobalFoundries · 68 open roles · median 99 d
- Texas Instruments · 50 open roles · median 41 d
- STMicroelectronics · 49 open roles · median 54 d
- Entegris · 44 open roles · median 20 d
How we counted: 1057 open Process Engineering (Semiconductor Process) roles from 59 employers tracked in the SemiconductorJobs index, counted 30 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.