Process Engineer工艺工程师 - Beijing, China
Originally posted 7 September 2026 by the employer — open 14 days.
About the role
This role involves the development, optimization, and mass production maintenance of semiconductor packaging assembly processes.
What you'll do
- Develop, optimize, and maintain semiconductor packaging assembly processes.
- Define and optimize process flows, parameters, and control plans to ensure product quality and production stability.
- Conduct DOE experiments, process validation, and prepare/maintain process documentation.
- Apply SPC and CPK quality tools to analyze production data and continuously improve yield and production efficiency.
- Lead analysis of process anomalies and quality issues, and implement corrective and preventive measures.
- Drive process improvement and cost optimization projects to enhance manufacturing competitiveness.
What you'll need
- Bachelor's degree or above in Microelectronics, Materials, Automation, or related fields.
- 3+ years of relevant work experience in semiconductor packaging processes.
- Familiarity with semiconductor packaging processes, equipment, and quality management knowledge.
- Proficient with engineering and quality tools such as DOE, SPC, FMEA, APQP, PPAP, and capable of process analysis and problem-solving.
- Ability to read and communicate in English technical documents.
Skills: semiconductor packaging, process development, process optimization, yield, SPC
This role has been open 14 days — well below the 67-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
67 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (196 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 20 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 173 | 9346 · 108 employers |
| Median days open | 25 d | 67 d (−42 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: semiconductor packaging, process development, process optimization, yield, SPC
Who's hiring in this category
- Infineon Technologies · 27 open roles · median 32 d
- Micron Technology · 19 open roles · median 143 d
- Renesas Electronics (this employer) · 19 open roles · median 25 d
- Intel Corporation · 12 open roles · median 149 d
- Monolithic Power Systems · 12 open roles · median 185 d
- onsemi · 7 open roles · median 65 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 21 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.