Process Engineer - Bayan Lepas, my, Malaysia
Originally posted 14 September 2026 by the employer — open 4 days.
About the role
This role involves the setup, optimization, yield improvement, and troubleshooting of semiconductor back-end assembly processes. The focus will be on die bonding and wire bonding processes within the manufacturing environment.
What you'll do
- Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements.
- Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues.
- Support new product introduction (NPI), process qualification, and transfer to mass production.
- Establish and maintain process parameters, work instructions, and control plans.
- Analyze process data using statistical methods (e.g., SPC, CPK, trend analysis).
- Drive continuous improvement activities for cost, yield, cycle time, and reliability.
What you'll need
- Bachelor’s degree in Engineering (Materials, Mechanical, or related field).
- Minimum 2 years of experience in semiconductor back-end assembly.
- Strong knowledge of die bonding and wire bonding processes.
- Familiarity with back-end materials such as leadframes, substrates, adhesives, and bonding wires.
- Experience with process characterization, DOE, and data analysis.
Skills: die bond, wire bond, back-end assembly, process optimization, NPI
This role has been open 4 days — well below the 65-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
199
|
Median days open
65 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (199 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 19 | 199 |
| Open roles in the wider Process, Fab & Equipment family | 174 | 9328 · 108 employers |
| Median days open | 23 d | 65 d (−42 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: die bond, wire bond, back-end assembly, process optimization, NPI
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 30 d
- Micron Technology · 19 open roles · median 141 d
- Renesas Electronics (this employer) · 19 open roles · median 23 d
- Intel Corporation · 12 open roles · median 147 d
- Monolithic Power Systems · 12 open roles · median 183 d
- onsemi · 7 open roles · median 63 d
How we counted: 199 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.