Process Development Engineer | RF Photonics - Dallas, TX, United States

Originally posted 21 September 2026 by the employer — open 1 day.

About the role

This role involves leading the development and implementation of heterogeneous integration of non-Si modulator materials into high-volume silicon photonics, from initial process development through volume scaling.

What you'll do

• Lead the process development, execution, and optimization of volume die-to-wafer (D2W) bonding and post-bond device processing of non-Si material chiplets, integrated in silicon photonics.
• Own part or all the non-Si material chiplet integration process module in the cleanroom, including dicing, grinding, die-to-wafer bonding, and waveguide etching.
• Drive the scaling of heterogeneous integration processes from initial R&D and prototyping up to high volume manufacturing.
• Provide expertise to bridge internal fab operations, advanced process development, and Kilby R&D design teams.
• Establish robust process controls, root-cause failure analysis, and yield enhancement strategies.
• Develop process characterization and troubleshooting procedures, including process monitors, test structures, and metrology.

What you'll need

• Master’s/Ph.D. degree in Electrical Engineering, Physics, Applied Physics, or Material Science.
• 3+ years of industry experience with processing steps for integration of non-Si high-speed modulator materials onto silicon photonics in a high volume silicon photonics fab environment.
• Experience with planarization and pre-bond surface preparation, die-to-wafer bonding, wafer-to-wafer bonding, post-bond waveguide etching and processing, and metallization.
• Experience with material physics and process-related effects on device performance for Lithium Niobate, Lithium Tantalate, Barium Titanate, or Indium Phosphide.
• Track record of delivering high yield process modules for high speed silicon photonics fab processes involving heterogeneous integration of non-materials in high volume manufacturing.
• Strong expertise in statistical process control (SPC), design of experiments (DOE), and utilizing advanced material characterization techniques applied to Cpk optimization.

Nice to have

• Understanding of the mechanisms of direct bonding methods (i.e. fusion bonding) and surface chemistry of bonding.
• Hands-on cleanroom experience with dicer, grinder, and bonder (die-to-wafer or wafer-to-wafer).
• Knowledge of high-speed photonic modulator device physics, device design, and device performance metrics.
• Understanding of characterization and testing of high-speed modulators and silicon photonic devices.
• Experience with volume manufacturing of high speed integrated photonic devices for data communications products.
• Experience using process monitor and test data analysis tools and statistical analysis tools such as JMP or statistical libraries (e.g. Matlab, Python).

Skills: silicon photonics, die-to-wafer bonding, non-Si material chiplets, heterogeneous integration, waveguide etching