Process develop engineer - Suzhou, Jiangsu, China
Originally posted 27 August 2026 by the employer.
About the role
This role is responsible for the development and characterization of assembly processes for Power Semiconductor End of Line (EOL) processes. The position focuses on enabling technology development and feasibility studies in prototyping lines.
What you'll do
- Develop and characterize assembly processes for Code-S and Enabling Technology in Semiconductor EOL.
- Define Key Process Input Variables (KPIV) and Key Process Output Variables (KPOV) from FMEA failure modes.
- Generate and create preliminary Control Plans from Design/Process FMEA according to APQP procedures.
- Lead prototyping line sample building and manage equipment maintenance.
- Design and work with vendors for new Tool and JIG designs.
- Initiate new processes and equipment, including PO specification generation and buy-off.
What you'll need
- More than 5 years of experience in EOL Process, PKG Saw, and Jig Saw.
- Experience in End of Line processes (Mold, Trim/Form, Sn Plating, LASER Marking, Laser Deflash).
- Experience in Semiconductor Assembly Process Development, Equipment and Tooling set-up, and process/equipment/material troubleshooting.
- Experience in Purchase specification/selection and Qualification for equipment and material.
- Bachelor's degree in Mechanical, Electric, or Automation Engineering.
- Proficiency in JMP & Data analysis, Excel Spreadsheet, Power Point Presentation, and AutoCAD.
Nice to have
- Design Career and Equipment Engineering Experience.
- Consulting on Leadframe design and understanding FOL area.
- Master's Degree.
Skills: Assembly Process Development, EOL Process, PKG Saw, Tool and JIG design, Process FMEA
This role has been open 31 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
297
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (297 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 15 | 297 |
| Open roles in the wider Process, Fab & Equipment family | 285 | 9489 · 108 employers |
| Median days open | 19 d | 58 d (−39 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: Assembly Process Development, EOL Process, PKG Saw, Tool and JIG design, Process FMEA
Who's hiring in this category
- KLA Corporation · 50 open roles · median 108 d
- Micron Technology · 33 open roles · median 32 d
- Infineon Technologies · 18 open roles · median 47 d
- Renesas Electronics · 18 open roles · median 23 d
- onsemi (this employer) · 15 open roles · median 19 d
- Intel Corporation · 14 open roles · median 76 d
How we counted: 297 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 28 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.