Principle Applications Engineer, 3DIC SI PI
Originally posted 20 October 2026 by the employer.
About the role
As a Principle Applications Engineer for 3DIC SI PI, you will engage directly with customers to address their signal integrity, power integrity, and advanced packaging challenges using Synopsys tools. The role focuses on guiding technical evaluations, setting up multi-physics simulations, and supporting 3D IC, chiplet, and heterogeneous integration designs.
What you'll do
- Engage directly with new and existing customers to understand signal integrity, power integrity, and advanced packaging challenges, demonstrating how Synopsys tools resolve them in their design context. - Run multi-physics simulations using HFSS, SIwave, Q3D, Ansys, Clarity, or similar tools to validate product performance and drive customer evaluations. - Provide technical support and troubleshooting for customers working on 3D IC and advanced packaging designs, assisting with model setup, result interpretation, and workflow optimization. - Collaborate with product management and R&D teams to channel customer insights back into the product roadmap and assist in prioritizing feature development. - Build and deliver technical presentations, application notes, and proof-of-concept demos showcasing measurable value in customer scenarios. - Travel approximately 25% of the time to customer sites for onsite evaluations, training sessions, and technical reviews.
What you'll need
- Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, or a related field. - Minimum 2 years of hands-on experience in 3D IC and advanced packaging design or analysis. - Proficiency with at least one simulation tool among HFSS, SIwave, Q3D, Ansys, or Clarity, including setup, execution, and interpretation of multi-physics simulations. - Strong working knowledge of signal integrity and power integrity principles, including transmission line effects, crosstalk, PDN analysis, and resonance. - Demonstrated ability to work directly with customers in evaluation, support, or training contexts. - Willingness and ability to travel to customer sites approximately 25% of the time.
Nice to have
- Experience with thermal or electrothermal analysis.
Skills: 3D IC, Signal Integrity, Power Integrity, HFSS, SIwave, Advanced Packaging