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Renesas Electronics

Principal Supplier Quality Engineer (Module Assembly) - Suzhou, China

Renesas Electronics Suzhou, China Full-time 12 days ago
Digital Design & SoC Architecture

Originally posted 23 September 2026 by the employer.

This role focuses on AI High Density Power Modules product families.

About the role

This role involves supporting Supplier Quality Systems through evaluation of key process metrics, verification of specific requirements, and continuous improvement for Renesas. This position focuses on AI High Density Power Modules product families and provides regional liaison for subcontracted manufacturing operations and component suppliers.

What you'll do

  • Serve as liaison between regional suppliers and Renesas.
  • Manage quality excursions and drive effective root cause solutions and preventive actions.
  • Support process/material change processes and site certification and audit activities.
  • Collaborate with component suppliers to ensure compliance with quality standards for power modules.
  • Support PCB assembly processes, with a focus on surface mount technology (SMT) and related manufacturing techniques.
  • Identify quality trends, manage projects, and influence teams to drive continuous improvement.

What you'll need

  • BS in Electrical Engineering or related field.
  • Minimum 10 years relevant experience in supplier quality management, including supplier selection, ongoing quality improvement, and manufacturing excursion response management.
  • Strong technical knowledge of semiconductor module assembly processes (e.g., SMT), passive components (inductors, capacitors), and embedded substrates processes.
  • Proven experience in PCB assembly, especially surface mount technology (SMT).
  • Hands-on experience with structured problem-solving tools such as 8D, 5-Why, and Fishbone analysis.
  • Understanding of standards ISO9001, IATF16949, VDA6.3 and process audit methodology, as well as quality tools FMEA, Control Plan, SPC, and MSA.
  • Certified or qualified auditor for ISO 9001, IATF 16949, and VDA 6.3.

Nice to have

  • Experience or knowledge of advanced semiconductor packaging (e.g., Multi-Chip Modules, Wafer-Level Chip Scale Packages).
  • Knowledge and practical use of ISO9001 and IATF16949 Core Tools.
  • Proven ability to influence suppliers and drive timely resolution of quality issues.
  • Experience working in a regional or global supplier quality environment.
Market context

This role has been open 0 days — well below the 47-day median for Hardware Systems Engineering roles.

Hardware Systems Engineering · AI ML Hardware

Open roles in category
831
Median days open
47 d
Median salary
$159k
See the full market breakdown ▾Category comparison, and who else is hiring
How Renesas Electronics compares in Hardware Systems Engineering hiring
Metric Renesas Electronics All employers we track in this specialty (831 roles · 101 employers)
Open roles in this specialty 16 831
Open roles in the wider Software, Firmware & Systems family 131 5948 · 143 employers
Median days open 48 d 47 d (+1 d vs this employer)
Median salary (USD postings) — $159k

Who's hiring in this category

  • Intel Corporation · 55 open roles · median 25 d
  • NVIDIA · 54 open roles · median 51 d
  • KLA Corporation · 48 open roles · median 39 d
  • AMD · 45 open roles · median 50 d
  • Applied Materials · 42 open roles · median 59 d
  • Teradyne · 42 open roles · median 53 d

How we counted: 831 open Hardware Systems Engineering (AI ML Hardware) roles from 101 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.

Apply now
Suzhou, China
On-site
Full-time
12 days ago

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